MX3A-12SA Datasheet, PDF (1/2 Pages) Bourns Electronic Solutions – SMT Non-Isolated Power Module

*RoHS ^COMPLIANT
Features
■ Industry standard SMT package
■ Output voltage programmable from
0.75 Vdc to 5.5 Vdc via external resistor
■ 3 A output current
■ Up to 95 % efficiency
■ Small size, low profile
■ Low output ripple and noise
■ High reliability
■ Remote on/off
■ Output overcurrent protection
(non-latching)
■ Cost-efficient
MX3A-12SA(-P) SMT Non-Isolated Power Module
Description
Bourns^® MX3A-12SA(-P) is a non-isolated DC-DC converter offering designers a cost and space-efficient solution with standard
features such as remote on/off, precisely regulated programmable output voltage and overcurrent protection.
Specifications
Parameter
INPUT
Voltage
Current
Remote ON/OFF:
Low or Open =
High =
Standard
On
Off
-P Option
Off
On
OUTPUT
Voltage Adjustment Range
Current
Voltage Setpoint Accuracy
Line Regulation
Load Regulation
Temperature Regulation
Ripple (pk-pk) (20 MHz Bandwidth)
Ripple (rms)
Dynamic Load Response:
50 % to 100 % Load or 100 % to 50 % Load;
(∆i/∆t = 2.5 A/µs; 25 °C)
50 % to 100 % Load or 100 % to 50 % Load;
(∆i/∆t = 2.5 A/µs; 25 °C)
GENERAL
MTBF
Operating Temperature
Storage Temperature
Switching Frequency
Efficiency
(Vin = 12 Vdc, TA= 25 °C, Full Load)
Min. Nom. Max.
Units
Notes
8.3
12
2.4
0.75
0.0
-2.5
0.3
0.4
0.4
30
10
200
25
75
100
14
Vdc
2.0
Adc
0.4
Vdc
Vin
Vdc
18 V max. for -W version
10 µA max.
1 mA max.
5.5
Vdc
3.0
Adc
2.5
% Vo,set
% Vo,set
% Vo,set
% Vo,set
0 to +85 °C
50
mVpk-pk 1 µF ceramic//10 µF tantalum capacitors
15
mVrms 1 µF ceramic//10 µF tantalum capacitors
mV
1 µF ceramic//10 µF tantalum capacitors
µs
mV
µs
2 x 100 µF polymer capacitors
13,000
-40
+85
-55
+125
300
86.0
88.0
90.0
91.0
93.0
95.0
kHrs
°C
°C
kHz
%
%
%
%
%
%
Vo,set = 1.2 Vdc
Vo,set = 1.5 Vdc
Vo,set = 1.8 Vdc
Vo,set = 2.5 Vdc
Vo,set = 3.3 Vdc
Vo,set = 5.0 Vdc
Applications
■ Intermediate Bus architecture
■ Distributed power applications
■ Workstations and servers
■ Telecom equipment
■ Enterprise networks including LANs/WANs
■ Latest generation ICs (DSP, FPGA, ASIC) and microprocessor powered applications
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.