MX10A-3-5SA Datasheet, PDF (1/2 Pages) Bourns Electronic Solutions – SMT Non-Isolated Power Module

*RoHS ^COMPLIANT
Features
■ Industry standard SMT package
■ Output voltage programmable from
0.75 Vdc to 3.6 Vdc via external resistor
■ 10 A output current
■ Up to 95 % efficiency
■ Small size, low profile
■ Cost-efficient
■ Low output ripple and noise
■ High reliability
■ Remote on/off
■ Output overcurrent protection
(non-latching)
■ Optional sequencing function
MX(T)10A-3-5SA SMT Non-Isolated Power Module
Description
Bourns^® MX(T)10A-3-5SA is a non-isolated DC-DC converter offering designers a cost and space-efficient solution with standard
features such as remote on/off, precisely regulated programmable output voltage and overcurrent protection and optional output
voltage sequencing.
Specifications
Parameter
Min. Nom. Max.
Units
Notes
INPUT
Voltage
2.4
5.5
Vdc
OBSOLETE ^Current
Remote: ON/OFF
Low or Open =
High =
Standard
On
Off
-P option
Off
On
OUTPUT
Voltage Adjustment Range
Current
Voltage Setpoint Accuracy
Line Regulation
Load Regulation
Temperature Regulation
Ripple (pk-pk) (20 MHz Bandwidth)
Ripple (rms)
Dynamic Load Response:
50 % to 100 % Load or 100 % to 50 % Load;
10.0
Adc
0.4
Vdc
2.4
Vin
Vdc
10 µA max.
1 mA max.
0.75
3.63
Vdc
0.0
10.0
Adc
-2.0
2.0
% Vo, _set
0.3
% Vo, _set
0.4
% Vo, _set
0.4
% Vo, _set
25
50
mVpk-pk 1 µF ceramic//10 µF tantalum capacitors
8
15
mVrms 1 µF ceramic//10 µF tantalum capacitors
200
mV
1 µF ceramic//10 µF tantalum capacitors
(∆i/∆t = 2.5 A/µs; 25 °C)
25
µs
50 % to 100 % Load or 100 % to 50 % Load;
(∆i/∆t = 2.5 A/µs; 25 °C)
100
100
mV
µs
2 x 150 µF polymer capacitors
GENERAL
MTBF
Operating Temperature
13,675
-40
+85
kHrs
°C
Storage Temperature
-55
+125
°C
Switching Frequency
Efficiency
(Vin = 5 Vdc, TA= 25 °C, Full Load)
300
kHz
82.5
%
Vo,set = 0.75 Vdc
88.0
%
Vo,set = 1.2 Vdc
89.5
%
Vo,set = 1.5 Vdc
91.0
%
Vo,set = 1.8 Vdc
93.0
%
Vo,set = 2.5 Vdc
95.0
%
Vo,set = 3.3 Vdc
Applications
■ Intermediate Bus architecture
■ Distributed power applications
■ Workstations and servers
■ Telecom equipment
■ Enterprise networks including LANs/WANs
■ Latest generation ICs (DSP, FPGA, ASIC) and microprocessor powered applications
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.