MF-USMF005 Datasheet, PDF (1/4 Pages) Bourns Electronic Solutions – MF-USMF Series - PTC Resettable Fuses PC motherboards Digital cameras

*RoHS ^COMPLIANT
Features
■ Fast tripping resettable circuit protection
■ Surface mount packaging for automated
assembly
■ Small footprint size (1210)
■ RoHS compliant* and halogen free**
■ Agency recognition*
Applications
■ Game consoles
■ PC motherboards
■ USB port protection - USB 2.0, 3.0 & OTG
■ HDMI 1.4 Source protection
■ IEEE 1394 ports
■ Mobile phones
■ Digital cameras
MF-USMF Series - PTC Resettable Fuses
Electrical Characteristics
Model
V max.
Volts
MF-USMF005
30
MF-USMF010
30
MF-USMF020
30
MF-USMF035
6
MF-USMF050
13.2
MF-USMF075
6
MF-USMF110
6
MF-USMF150
6
MF-USMF175X***
6
*** CSA approval pending.
I max.
Amps
10
10
10
40
40
40
40
40
40
Ihold
Itrip
Amperes
at 23 °C
Hold
Trip
0.05
0.15
0.10
0.30
0.20
0.40
0.35
0.75
0.50
1.00
0.75
1.50
1.10
2.20
1.50
3.00
1.75
3.50
Resistance
Ohms
at 23 °C
RMin. R1Max.
2.800 50.000
0.800 15.000
0.400 5.000
0.200 1.300
0.180 0.900
0.070 0.450
0.050 0.210
0.030 0.110
0.020 0.090
Max. Time
To Trip
Amperes Seconds
at 23 °C at 23 °C
0.25
1.50
0.50
0.60
8.00
0.02
8.00
0.20
8.00
0.10
8.00
0.10
5.00
1.00
5.00
5.00
8.00
1.00
Tripped
Power
Dissipation
Watts
at 23 °C
Typ.
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.7
Environmental Characteristics
Operating Temperature......................................... -40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State .................................................... 125 °C
Passive Aging....................................................... +85 °C, 1000 hours............................................... ±5 % typical resistance change
Humidity Aging ..................................................... +85 °C, 85 % R.H. 1000 hours ............................. ±5 % typical resistance change
Thermal Shock ..................................................... +85 °C to -40 °C, 20 times ................................... ±10 % typical resistance change
Solvent Resistance............................................... MIL-STD-202, Method 215................................... No change
Vibration ............................................................... MIL-STD-883C, Method 2007.1, .......................... No change
Condition A
Test Procedures And Requirements For Model MF-USMF Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech.......................................................... Verify dimensions and materials ........................... Per MF physical description
Resistance............................................................ In still air @ 23 °C.................................................. Rmin ≤ R ≤ R1max
Time to Trip........................................................... At specified current, Vmax, 23 °C ........................ T ≤ max. time to trip (seconds)
Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip
Trip Cycle Life....................................................... Vmax, Imax, 100 cycles........................................ No arcing or burning
Trip Endurance ..................................................... Vmax, 48 hours..................................................... No arcing or burning
Solderability.......................................................... ANSI/J-STD-002................................................... 95 % min. coverage
UL File Number .................................................... E174545
http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545
CSA File Number.................................................. CA110338
http://directories.csa-international.org/ Under “Certification Record” and “File Number”
enter 110338-0-000
TÜV Certificate Number ....................................... R 02057213
http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
**To be considered halogen free, each homogenous material can have a maximum concentration of 900 ppm of either bromine or chlorine.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.