MF-SD013_12 Datasheet, PDF (1/3 Pages) Bourns Electronic Solutions – Telecom PTC Resettable Fuses

*RoHS ^COMPLIANT
Features
■ Tip & ring line protection with two devices
in one surface mount package
■ High voltage surge capabilities
■ Assists in meeting ITU-T K.20/K.21/K.45
specifications as well as Telcordia GR-1089
intra-building
■ RoHS compliant*
■ Agency recognition:
Applications
Used as a secondary overcurrent protection
device in:
■ Customer Premise Equipment (CPE)
■ Central Office (CO)
■ Subscriber Line Interface Cards (SLIC)
MF-SD/250 Series - Telecom PTC Resettable Fuses
Electrical Characteristics
Model
Max.
Operating
Voltage
Volts
Max.
Interrupt
Ratings
Volts
(V)
Amps
(A)
MF-SD013/250
60
250
3.0
Ihold Itrip
Amperes
at 23 °C
Hold
Trip
0.13 0.26
Initial
Resistance
Ohms
at 23 °C
Min. Max.
2.0
7.0
* R1 value is measured 24 hours post reflow.
Resistance matched in housing: 1.0 ohm measured 24 hours after reflow installation.
1 Hour (R1)
Post-Trip
Resistance*
Ohms
at 23 °C
Max.
10.0
Nominal Time
to Trip
Amps
at 23 °C
Seconds
at 23 °C
1
2.5
Tripped
Power
Dissipation
Watts
at 23 °C
Typ.
1.5
Environmental Characteristics
Operating Temperature.................................... -45 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State............................................ 125 °C
Passive Aging .................................................. +85 °C, 1000 hours................................................±15 % typical resistance change
..................................................................... +60 °C, 1000 hours................................................±15 % typical resistance change
Humidity Aging................................................. +85 °C, 85 % R.H. 1000 hours ..............................±15 % typical resistance change
Thermal Shock ................................................ MIL-STD-202F, Method 107G,...............................±10 % typical resistance change
+125 °C to -55 °C,10 times
±15 % typical resistance change
Solvent Resistance.......................................... MIL-STD-202, Method 215B..................................No change
Lead Solderability ............................................ ANSI/J-STD-002
Flammability .................................................... IEC 695-2-2 ...........................................................No Flame for 60 secs.
Vibration .......................................................... MIL-STD-883C, Method 2007.1, Condition A ........No change
Test Procedures And Requirements For Model MF-SD/250 Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech. .................................................... Verify dimensions and materials .......................Per MF physical description
Resistance....................................................... In still air @ 23 °C.............................................Rmin ≤ R ≤ Rmax
Time to Trip...................................................... At specified current, Vmax, 23 °C.....................T ≤ max. time to trip (seconds)
Hold Current .................................................... 30 min. at Ihold .................................................No trip
Test
Test Conditions
Primary
Protection
Mains Power Contact - ITU-T K.20, K.21 ........ 230 V rms, 10 ohms, t = 15 min........................None
Power Induction - ITU-T K.20, K.21................. 600V rms, 600 ohms, t = 0.2 seconds ..............None
Power Induction - ITU-T K.20, K.21................. 600 V rms, 600 ohms, t = 1 second..................GDT
Lightning Surge - ITU-T K.20, K.21 ................. 1.5 KV, 10/700 μs .............................................None
Lightning Surge ............................................... 4.0 KV, 10/700 μs .............................................GDT
UL File Number ........................................... E 174545S
Thermal Derating Chart -Ihold (Amps)
Model
MF-SD013/250
-40 °C
0.21
-20 °C
0.18
Ambient Operating Temperature
0 °C
23 °C
40 °C
50 °C
60 °C
0.16
0.13
0.10
0.09
0.08
70 °C
0.07
85 °C
0.05
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.