MF-RHT_13 Datasheet, PDF (1/4 Pages) Bourns Electronic Solutions – PTC Resettable Fuses

AEC*ARPoPHRSOCVOEMDP(LSIeAlNecTt ^Models)
4R1H8705S0
Features
■ Compliant with AEC-Q200 Rev-C- Stress
Test Qualification for Passive Components
in Automotive Applications
■ Operating temperature range up to 125 °C
■ Low thermal derating factor
■ Higher hold currents at elevated
temperature
■ Choice of operating currents
■ RoHS compliant* and Pb free
■ Resettable fault protection of general
electronic equipment
MF-RHT Series - PTC Resettable Fuses
Electrical Characteristics
Model
MF-RHT070
MF-RHT200
MF-RHT450
MF-RHT650
MF-RHT750
MF-RHT1300
V max.
Volts
I max.
Amps
16
40
16
100
16
100
16
100
16
100
16
100
Ihold
Itrip
Amperes
at 23 °C
Hold
Trip
0.7
1.4
2.0
3.8
4.5
7.8
6.5
12.0
7.5
13.1
13.0
24.0
Resistance
Ohms
at 23 °C
RMin.
R1Max.
(Post Trip)
0.3
0.8
0.045
0.110
0.022
0.054
0.011
0.026
0.0094
0.022
0.0041
0.010
Max. Time
To Trip
Amperes Seconds
at 23 °C at 23 °C
Max.
3.5
4.0
12.5
3.0
22.5
3.0
32.5
5.5
37.5
7.0
60.0
13.0
Tripped
Power
Dissipation
Watts
at 23 °C
Typ.
1.4
1.4
3.6
4.3
4.5
6.9
Environmental Characteristics
Operating Temperature......................................... -40 °C to +125 °C
Storage Temperature............................................ -40 °C to +85 °C
Passive Aging ....................................................... +85 °C, 1000 hours............................................... ±15 % typical resistance change
Humidity Aging...................................................... +85 °C, 85 % R.H. 1000 hours ............................. ±15 % typical resistance change
Thermal Shock ..................................................... MIL-STD-202, Method 107, .................................. ±10 % typical resistance change
+125 °C to -40 °C,10 cycles
Vibration ............................................................... MIL-STD-883C, Method 2007.1, Condition A ....... No change
Test Procedures And Requirements For Model MF-RHT Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description
Resistance............................................................ In still air @ 23 °C ................................................. Rmin ≤ R ≤ R1max
Time to Trip........................................................... At specified current, Vmax, 23 °C......................... T ≤ max. time to trip (seconds)
Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip
Trip Cycle Life....................................................... Vmax, Imax, 100 cycles........................................ No arcing or burning
Trip Endurance ..................................................... Vmax, 48 hours..................................................... No arcing or burning
Solderability .......................................................... MIL-STD-202, Method 208 ................................... 95 % min. coverage
Thermal Derating Chart - Ihold (Amps)
Model
MF-RHT070
MF-RHT200
MF-RHT450
MF-RHT650
MF-RHT750
MF-RHT1300
-40 °C -20 °C
0 °C
0.95
0.87
0.79
2.71
2.49
2.26
6.1
5.6
5.1
8.8
8.1
7.4
10.2
9.4
8.6
17.7
16.3
14.8
Ambient Operating Temperature
23 °C
40 °C
50 °C
60 °C
0.7
0.62
0.56
0.51
2.00
1.77
1.60
1.46
4.5
4.0
3.6
3.3
6.5
5.7
5.3
4.8
7.5
6.6
6.1
5.6
13.0
11.4
10.5
9.6
70 °C
0.47
1.34
3.0
4.3
5.0
8.6
85 °C
0.39
1.11
2.5
3.6
4.1
7.2
125 °C
0.17
0.49
1.1
1.6
1.9
3.3
How to Order
MF - RHT 750 - __
Multifuse^® Product
Designator
Series
RHT = High Temperature
Radial Leaded Component
Hold Current, Ihold
070 - 1300 (0.70 - 13.00 Amps)
Packaging Options
- = Bulk Packaging
- 2 = Tape and Reel*
- AP = Ammo-Pak*
*Packaged per EIA 486-B
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications
and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.