MF-MSMD010 Datasheet, PDF (1/4 Pages) Bourns Electronic Solutions – PTC Resettable Fuses

Electrical Characteristics
Model
MF-MSMD010
MF-MSMD014
MF-MSMD020
MF-MSMD030
MF-MSMD050
MF-MSMD075
MF-MSMD110
MF-MSMD125
MF-MSMD150
MF-MSMD160
MF-MSMD200
MF-MSMD260
V max.
Volts
60.0
60.0
30.0
30.0
15.0
13.2
6.0
6.0
6.0
8.0
6.0
6.0
Features
■ 4.5 mm SMD
■ Fast tripping resettable circuit protection
■ Surface mount packaging for automated
assembly
■ Reduced component size and resistance
■ Agency recognition:
T V Rheinland
Applications
High Density Circuit Board Applications:
■ Hard disk drives
■ PC motherboards
■ PC peripherals
■ Point-of-sale (POS) equipment
■ PCMCIA cards
MF-MSMD Series - PTC Resettable Fuses
I max.
Amps
40
40
80
10
100
100
100
100
100
100
100
100
Ihold
Itrip
Amperes
at 23 °C
Hold
Trip
0.10
0.30
0.14
0.34
0.20
0.40
0.30
0.60
0.50
1.00
0.75
1.50
1.10
2.20
1.25
2.50
1.50
3.00
1.60
2.80
2.00
4.00
2.60
5.20
Resistance
Ohms
at 23 °C
RMin.
R1Max.
0.70
15.00
0.40
6.50
0.40
6.00
0.30
3.00
0.15
1.00
0.11
0.45
0.04
0.21
0.035
0.14
0.03
0.120
0.035
0.099
0.020
0.100
0.015
0.080
Max. Time
To Trip
Amperes Seconds
at 23 °C at 23 °C
0.5
1.5
1.5
0.15
6.0
0.06
8.0
0.10
8.0
0.15
8.0
0.20
8.0
0.30
8.0
0.4
8.0
0.5
8.0
2.0
8.0
3.0
8.0
5.0
Tripped
Power
Dissipation
Watts
at 23 °C
Typ.
1.0
1.0
1.0
1.2
1.2
1.2
1.2
1.5
1.5
1.5
1.5
1.5
Environmental Characteristics
Operating/Storage Temperature ........................-40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State ................................................125 °C
Passive Aging......................................................+85 °C, 1000 hours ....................................±5 % typical resistance change
Humidity Aging....................................................+85 °C, 85 % R.H. 1000 hours....................±5 % typical resistance change
Thermal Shock ....................................................+85 °C to -40 °C, 20 times ..........................±10 % typical resistance change
Solvent Resistance ............................................MIL-STD-202, Method 215 ........................No change
Vibration ..............................................................MIL-STD-883C, Method 2007.1, ................No change
Condition A
Test Procedures And Requirements For Model MF-MSMD Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description
Resistance ......................................In still air @ 23 °C ............................................................Rmin ≤ R ≤ R1max
Time to Trip ....................................At specified current, Vmax, 23 °C ..................................T ≤ max. time to trip (seconds)
Hold Current....................................30 min. at Ihold ..............................................................No trip
Trip Cycle Life ................................Vmax, Imax, 100 cycles ..................................................No arcing or burning
Trip Endurance ................................Vmax, 48 hours ..............................................................No arcing or burning
Solderability ....................................MIL-STD-202F, Method 208F..........................................95 % min. coverage
UL File Number ..................................E174545
http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545
CSA File Number ................................CA110338
http://directories.csa-international.org/ Under “Certification Record” and “File Number” enter 110338-0-000
TÜV Certificate Number......................R 02057213
http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.