MF-LSMF185-33X Datasheet, PDF (1/4 Pages) Bourns Electronic Solutions – PTC Resettable Fuses

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Features
■ High power ratings
■ Compliant with AEC-Q200 Rev-C- Stress
Test Qualification for Passive Components
in Automotive Applications
■ Low profile
■ Compatible with Pb and Pb-free solder
reflow profiles
■ Surface mount packaging for automated
assembly
■ Agency recognition:
■ Standard 7555 mm (2920 mils) footprint
■ RoHS compliant* and halogen free**
MF-LSMF Series - PTC Resettable Fuses
Electrical Characteristics
Model***
MF-LSMF185/33X
V max.
Volts
33.0
I max.
Amps
40
Ihold
Itrip
Amperes
at 23 °C
Hold
Trip
1.85
3.70
MF-LSMF260X
24.0
20
2.60
5.20
MF-LSMF300X
6.0
40
3.00
5.00
MF-LSMF300/24X
24.0
20
3.00
5.20
*** Features Multifuse^® Free Xpansion Design^™ for MF-LSMF Series.
Resistance
Ohms
at 23 °C
RMin. R1Max.
0.045 0.150
0.020 0.075
0.015 0.048
0.020 0.075
Max. Time
To Trip
Amperes Seconds
at 23 °C at 23 °C
8.0
2.50
8.0
5.00
8.0
20.00
8.0
5.00
Tripped
Power
Dissipation
Watts
at 23 °C
Typ.
1.5
1.5
1.5
1.5
Environmental Characteristics
Operating Temperature......................................... -40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State .................................................... 125 °C
Passive Aging ....................................................... +85 °C, 1000 hours............................................... ±5 % typical resistance change
Humidity Aging...................................................... +85 °C, 85 % R.H. 1000 hours ............................. ±5 % typical resistance change
Thermal Shock ..................................................... +85 °C to -40 °C, 20 times.................................... ±10 % typical resistance change
Solvent Resistance............................................... MIL-STD-202, Method 215 ................................... No change
Vibration ............................................................... MIL-STD-883C, Method 2007.1,........................... No change
Condition A
Test Procedures And Requirements For Model MF-LSMF Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description
Resistance............................................................ In still air @ 23 °C ................................................. Rmin ≤ R ≤ R1max
Time to Trip........................................................... At specified current, Vmax, 23 °C......................... T ≤ max. time to trip (seconds)
Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip
Trip Cycle Life....................................................... Vmax, Imax, 100 cycles........................................ No arcing or burning
Trip Endurance ..................................................... Vmax, 48 hours..................................................... No arcing or burning
Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage
UL File Number..................................................... E174545
http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545
TÜV Certificate Number ....................................... R 50256634
http://www.tuvdotcom.com/ Follow link to “Certificate Search”, enter 50256634
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
**Bourns is using the definition that appears to be the prevalent definition used as the industry standard at this time. The Bourns definition of “halogen-free” is:
Bromine (Br) content: ≤ 900 ppm; Chlorine (Cl) content: ≤ 900 ppm; Total Br + Cl content: ≤1500 ppm.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.