MF-LR Datasheet, PDF (1/4 Pages) Bourns Electronic Solutions – PTC Resettable Fuses

*RoHS ^COMPLIANT
0144T
Features
■ Axial leaded
■ Fully compatible with current
industry standards
■ Weldable nickel terminals
■ Very low internal resistance
■ Operating currents to 9.0 Amps
■ RoHS compliant*, lead free
■ Agency recognition:
T V Rheinland
Applications
■ Any application that requires protection
at low resistances
■ Rechargeable battery packs
■ Cellular phones
■ Laptop computers
MF-LR Series - PTC Resettable Fuses
Electrical Characteristics
Model
V max.
Volts
I max.
Amps
MF-LR190
15
100
MF-LR190S
15
100
MF-LR260
15
100
MF-LR260S
15
100
MF-LR380
15
100
MF-LR450
20
100
MF-LR550
20
100
MF-LR600
10
100
MF-LR730
10
100
MF-LR730/20* 20
100
MF-LR900/20* 20
100
* TÜV recognition pending.
Ihold
Itrip
Amperes
At 23 °C
Hold
1.90
Trip
3.90
1.90
3.90
2.60
5.80
2.60
5.80
3.80
8.30
4.50
8.90
5.50
10.50
6.00
11.70
7.30
14.10
7.30
14.10
9.00
16.70
Initial
Resistance
Ohms
At 23 °C
Min.
0.039
Max.
0.072
0.039
0.072
0.020
0.042
0.020
0.042
0.013
0.026
0.011
0.020
0.009
0.019
0.007
0.014
0.006
0.012
0.006
0.012
0.006
0.010
1 Hour (R1)
Post-Trip
Resistance
Max. Time
To Trip
Ohms Amperes Seconds
At 23 °C At 23 °C At 23 °C
Max.
0.102
9.5
5.0
0.102
9.5
5.0
0.063
13.0
5.0
0.063
13.0
5.0
0.037
19.0
5.0
0.028
22.5
5.0
0.022
27.5
5.0
0.016
30.0
5.0
0.015
30.0
5.0
0.015
30.0
5.0
0.014
45.0
5.0
Tripped
Power
Dissipation
Watts
At 23 °C
Typ.
1.2
1.2
1.3
2.5
2.5
1.4
1.4
2.8
3.0
3.0
3.0
Environmental Characteristics
Operating/Storage Temperature ........................-40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State ................................................125 °C
Passive Aging......................................................+70 °C, 1000 hours ....................................±10 % typical resistance change
Humidity Aging....................................................+85 °C, 85 % R.H. 7 days ..........................±10 % typical resistance change
Vibration ..............................................................MIL-STD-883C, Condition A ......................No change
Test Procedures And Requirements For Model MF-LR Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech. ......................................................Verify dimensions and materials..................Per MF physical description
Resistance ..........................................................In still air @ 23 °C ........................................Rmin ≤ R ≤ R1max
Time to Trip ........................................................At specified current, Vmax, 23 °C ..............T ≤ max. time to trip (seconds)
Hold Current ......................................................30 min. at Ihold............................................No trip
Trip Cycle Life ....................................................Vmax, Imax, 100 cycles ..............................No arcing or burning
Trip Endurance....................................................Vmax, 48 hours ..........................................No arcing or burning
UL File Number ..................................................E 174545S
CSA File Number ................................................CA 110338
TÜV File Number ................................................R2057213
Thermal Derating Chart - Ihold (Amps)
Model
MF-LR190
MF-LR190S
MF-LR260
MF-LR260S
MF-LR380
MF-LR450
MF-LR550
MF-LR600
MF-LR730
MF-LR730/20
MF-LR900/20
-40 °C
2.8
2.8
3.8
3.8
5.5
6.5
8.0
8.7
10.5
10.5
12.7
-20 °C
2.5
2.5
3.4
3.4
4.9
5.8
7.1
7.8
9.5
9.5
11.4
*Itrip is approximately two times Ihold.
0 °C
2.3
2.3
3.1
3.1
4.4
5.3
6.2
7.1
8.6
8.6
10.0
Ambient Operating Temperature
23 °C
1.9
1.9
2.6
2.6
3.8
4.5
5.5
6.0
7.3
7.3
9.0
40 °C
1.6
1.6
2.2
2.2
3.3
3.9
4.7
5.2
7.4
7.4
7.5
50 °C
1.5
1.5
2.0
2.0
3.0
3.6
4.3
4.7
6.8
6.8
6.8
60 °C
1.4
1.4
1.9
1.9
2.8
3.3
4.0
4.4
6.2
6.2
6.2
70 °C
1.2
1.2
1.7
1.7
2.5
2.9
3.6
3.9
5.5
5.5
5.5
85 °C
1.0
1.0
1.4
1.4
2.1
2.5
3.0
3.3
4.5
4.5
4.5
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.