MA3216_MDS Datasheet, PDF (1/1 Pages) Bourns Electronic Solutions – Chip Bead Array

MATERIAL DATA SHEET
Material
Product Line
Date
MA3216 Series
Chip Bead Array
04-December-2004
NO.
Construction
element
1
Core
2
Pad
3
Solder plate
4
Circuit
Material group
Ferrite
Material
Weight (g)
0.0204
Terminal
Electrode
Solder plate
Silver
Total weight
0.0009
0.0007
0.0019
0.024
Materials
Fe203
Copper Oxide
Nickel Oxide
Zinc Oxide
Lead Oxide
Ag
Ni
Sn
Ag
CAS
If applicable
------
------
-------
01314-13-2
1317-36-8
7440-22-4
7440-02-0
7440-31-5
7440-22-4
Average mass
(%)
Business
Confidential
Sum (%)
100
67
100
33
100
100
Traces
Headquarters Riverside CA
www.bourns.com
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