EAW Datasheet, PDF (1/2 Pages) Bourns Electronic Solutions – EAW (FR4 Element Version) Encoders

MATERIAL DECLARATION SHEET
Model
Product Line
Compliance Date
RoHS Compliant
EAW (FR4 Element Version)
Encoders
Septebmer 30, 2005
Yes
MSL
N/A
No.
Construction
Element (subpart)
Homogeneous Material Homogeneous Material/
CAS
Material
weight [g]
Substances
if applicable
Materials
Mass %
Material
Mass % of
total unit wt.
Subpart
mass of
total wt. [%]
FR-4
Phenol, 4,4'-(1-
methylethylidene)bis(2,6-
dibromo-,polymer with
(chloromethyl)oxirane and
26265-08-7
33
2.4172
4,4'-(1-
methylethylidene)bis(phenol)
Copper
7440-50-8
18
GF-Fibre
**********
49
11.421
6.295
16.958
34.608
Copper Anode
0.0404
Copper
7440-50-8
100
1
Circuit Board
Bisphenol A, epichlorohydrin
polymer
25068-38-6
40
(2-
Methoxymethylethoxy)propa 34590-94-8
10
nol
Soldermask
0.0168
Barium sulphate
7727-43-7
35
2-Methyl-1-(4-
methylthiophenyl)-2- 71868-10-5
10
morpholinopropan-1-one
Dipropylene glycol ethyl
ether
15764-24-6
5
ENIG
0.0056
Nickel bis(sulphamidate) 13770-89-3
97
Gold
7440-57-5
3
2
Solder
Solder
0.005
Tin
Silver
7440-31-5
95
7440-22-4
5
0.578
0.096
0.024
0.084
0.024
0.012
0.078
0.002
0.068
0.004
0.578
0.241
0.080
0.072