CW252016_MDS Datasheet, PDF (1/1 Pages) Bourns Electronic Solutions – Wirewound Chip Inductor

MATERIAL DECLARATION SHEET
Material Number
CW252016 Series
Product Line
Wirewound Chip Inductor
Compliance Date
01-April-2008
RoHS Compliant
Yes
MSL
1
No.
Construction
Element (subpart)
Homogeneous
Material
1
Ferrite
Ni-Zn Series
2
Metallizing
3
Plating
4
Coating
5
Wire
6
Ink
Winding
Marking
Total weight
Material
weight
[mg]
15.162
1.52
0.152
0.19
1.9
0.076
19
Homogeneous
Material\
Substances
Iron oxide (Fe₂O₃)
Zinc oxide (ZnO)
Copper oxide(CuO)
Nickel oxide (NiO)
Molybdenum
Manganese
Nickel
Gold
Tripropylene Glycol
Diacrycate
Oligomer
Urethana/Epoxy
Acrylate
Copper
Polyesterimide resin
Epoxy
CASRN
if applicable
1309-37-1
1314-13-2
1317-38-0
1313-99-1
7439-98-7
7439-96-5
7440-02-0
7440-57-5
68901-05-3
N/A
7440-50-8
N/A
N/A
Materials
Mass %
90
7
2
1
95
5
100
45
55
96
4
100
Material
Mass % of
total unit wt.
71.7
5.6
1.6
0.8
7.6
0.4
0.8
Subpart
mass of total
wt. (%)
79.7
8
0.8
0.45
1
0.55
9.6
10
0.4
0.4
0.4
This Document was updated on: 01-April-2008
Important remarks: It is the responsibility of the user to verify they are accessing the latest version.
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