CW201212_11 Datasheet, PDF (1/1 Pages) Bourns Electronic Solutions – High Q Chip Inductors

*RoHS ^COMPLIANT
Features
■ 0805 size
■ Available in E12 series
■ High Q up to 80 typ.
■ High operating temperature of 125 °C
■ Small size of only 2.0 mm
■ RoHS compliant*
Applications
■ Mobile phones
■ Cellular phones
■ CTV, VCR, HIC, FDD
CW201212 Series - High Q Chip Inductors
Electrical Specifications
Bourns Part No.
CW201212-2N2J
CW201212-2N7J
CW201212-2N8J
CW201212-3N3J
CW201212-3N9J
CW201212-4N7J
CW201212-5N6J
CW201212-6N8J
CW201212-8N2J
CW201212-10NJ
CW201212-12NJ
CW201212-15NJ
CW201212-18NJ
CW201212-22NJ
CW201212-27NJ
CW201212-33NJ
CW201212-39NJ
CW201212-47NJ
CW201212-56NJ
CW201212-68NJ
CW201212-82NJ
CW201212-R10J
CW201212-R12J
CW201212-R15J
CW201212-R18J
CW201212-R22J
CW201212-R27J
CW201212-R33J
CW201212-R39J
CW201212-R47J
CW201212-R56J
CW201212-R68J
CW201212-R82J
CW201212-R91J
Inductance
Q
nH
Tol. % min.
2.2
±5
50
2.7
±5
35
2.8
±5
32
3.3
±5
30
3.9
±5
60
4.7
±5
60
5.6
±5
60
6.8
±5
60
8.2
±5
60
10
±5
60
12
±5
60
15
±5
60
18
±5
60
22
±5
60
27
±5
60
33
±5
60
39
±5
60
47
±5
60
56
±5
60
68
±5
60
82
±5
60
100
±5
60
120
±5
50
150
±5
50
180
±5
50
220
±5
50
270
±5
45
330
±5
45
390
±5
45
470
±5
33
560
±5
23
680
±5
23
820
±5
23
910
±5
22
Packaging Specifications
178.0
(7.00)
DIA.
2.0 ± 0.5
(.079 ± .020)
12.5
(.492)
21.0 ± 0.8
(.827 ± .031)
13.0 ± 0.5
(.512 ± .020)
DIA.
13.0 ± 0.5
(.512 ± .020)
DIA.
10.0
(.393)
NOTE: 2 % TOLERANCE AVAILABLE FOR INDUCTANCE
RANGES OF 12 NH AND UP. REPLACE “J” WITH “G”.
Test Freq. MHz
L
Q
250 1000
250 1000
250 1000
250 1500
250 1000
250 1000
250 1000
250 1000
250 1000
250 500
250 500
250 500
250 500
250 500
250 500
250 500
250 500
200 500
200 500
200 500
150 500
150 500
150 250
100 250
100 250
100 250
100 250
100 250
100 250
250 100
50
50
25
50
25
50
22
50
SRF min.
MHz
6000
6000
6000
6000
6000
5800
5800
5800
5500
4800
4100
3600
3400
3300
2600
2400
2100
1700
1600
1450
1350
1200
1100
950
900
860
850
800
780
375
340
270
230
220
RDC
ohms
0.06
0.08
0.06
0.08
0.06
0.06
0.08
0.06
0.06
0.08
0.08
0.08
0.08
0.10
0.12
0.15
0.18
0.15
0.25
0.27
0.32
0.43
0.48
0.67
0.85
1.10
1.46
1.65
2.20
1.72
1.90
2.05
2.30
2.50
I rms
mA max.
600
600
800
600
600
600
600
600
600
600
600
600
600
600
600
500
500
500
500
500
500
400
400
400
350
300
250
200
170
250
230
190
180
150
General Specifications
Temperature Rise
...................40 ˚C max. at rated current
Operating Temperature
..................................-40 °C to +125 °C
Storage Temperature..-40 °C to +125 °C
Reflow Soldering ...230 °C, 50 sec. max.
Resistance to Soldering Heat
.................................260 ˚C, 5 seconds
Materials
Core Material
-2N2J through -R39J ..............Ceramic
-R47J through -R91J..................Ferrite
Wire ........Enamelled Copper (1W1E180)
Terminal............................Mo/Mn+Ni+Au
Packaging..................2,000 pcs. per reel
Product Dimensions
0.5
(.020)
1.3 ± 0.2
(.051 ± .008)
0.5
(.020)
2.1 ± 0.2
(.083 ± .008)
1.5 ± 0.2
(.059 ± .008)
0.5
(.020)
Recommended Layout
REF.
1.02
(.040)
1.02
(.040)
REF.
50.0
(1.969)
THICKNESS
0.10
(.004)
MAX.
EMBOSSED
CAVITY
REF.
0.76
(.030)
1.78
(.070)
REF.
DIMENSIONS:
MM
(INCHES)
EMBOSSED
CARRIER
8.0
(.315)
REV. 05/11
*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.