CRL2010 Datasheet, PDF (1/1 Pages) Bourns Electronic Solutions – Chip resistors

MATERIAL DECLARATION SHEET
Material Number
CRL2010
Product Line
Chip resistors
Compliance Date
4-1-2003
RoHS Compliant
YES
MSL
1
No.
Construction
Element(subpart)
Homogeneous
Material
1
Ceramic Substrate Alumina
2
Conductor Layer Glass
3
Resistive Element Glass
4
Over Coating
Epoxy
5
Marking
Epoxy
6
End Terminal
NI-CR
7
Nickel underplate Nickel
8
Matte tin plating Tin
Material
weight
[mg]
0.02036
0.00034
0.00027
0.00039
0.00003
0.00001
0.00058
0.00052
Homogeneous
Material\
Substances
Aluminum oxide
Silicon dioxide
Silver
Bismuth trioxide
Barium oxide
Silicon dioxide
Boron oxide
Ruthenium dioxide
Silver
Palladium
Lead oxide (Glass)
Epoxy
Epoxy
Nickel
Chromium III
Nickel
Tin
CASRN
if applicable
1344-28-1
14808-60-7
7440-22-4
1304-76-3
1304-28-5
7631-86-9
1303-86-2
12036-10-1
7440-22-4
7440-05-3
1317-36-8
29690-82-2
25068-38-6
7440-02-0
7440-47-3
7440-02-0
7440-31-5
Materials
Mass %
96%
4%
96%
1%
1%
1%
1%
25%
40%
15%
20%
100%
100%
80%
20%
100%
100%
Total weight
0.0225
This Document was updated on: 10.26.2010
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
2. RoHS exemption – 7(c)-I Electrical and electronic components containing lead in glass or ceramic...
Material
Mass % of
total unit wt.
86.8512%
3.6188%
1.43%
0.02%
0.02%
0.02%
0.02%
0.3025%
0.484%
0.1815%
0.242%
1.75%
0.11%
0.032%
0.008%
2.59%
2.32%
Subpart
mass of total
wt. (%)
90.47%
1.51%
1.21%
1.75%
0.11%
0.04%
2.59%
2.32%
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