CR0805 Datasheet, PDF (1/2 Pages) Bourns Electronic Solutions – Chip Resistors

MATERIAL DECLARATION SHEET
Material Number
CR0805
Product Line
Chip Resistors
Compliance Date
2010/10/29
RoHS Compliant
YES
MSL
1
No.
1
2
3
4
5
6
7
8
Construction
Element(subpart)
Ceramic Substrate
Conductor Layer
Resistive Element
Over Coating
Marking
End Terminal
Ni Plating
Sn Plating
Homogeneous
Material
Material
weight [g]
Ceramic
0.00381944
Conductor glass 0.00008224
Resistor glass
0.00004328
Epoxy
Epoxy
0.0000665
0.00000361
Nickel Chromium 0.00000337
Nickel
Matte Tin
0.00014111
0.00012589
Total weight 0.00428544
Homogeneous
Material\
Substances
Aluminum oxide
Silicon dioxide
Silver
Bismuth trioxide
Barium oxide
Silicon dioxide
Boron oxide
Ruthenium
dioxide
Silver
Palladium
Lead oxide
glass
Epoxy
Epoxy
Nickel
Chromium III
Nickel
Tin
CASRN
if applicable
1344-28-1
14808-60-7
7440-22-4
1304-76-3
1304-28-5
7631-86-9
1303-86-2
12036-10-1
7440-22-4
7440-05-3
1317-36-8
29690-82-2
25068-38-6
7440-02-0
7440-47-3
7440-02-0
7440-31-5
Materials
Mass %
96%
4%
96%
1%
1%
1%
1%
25%
40%
15%
20%
100%
100%
80%
20%
100%
100%
Material
Mass % of
total unit wt.
85.56%
3.57%
1.82%
0.025%
0.025%
0.025%
0.025%
Subpart
mass of total
wt. (%)
89.13%
1.92%
0.25%
0.40%
0.15%
1.01%
0.20%
1.55%
0.08%
0.06%
0.02%
3.29%
2.94%
1.55%
0.08%
0.08%
3.29%
2.94%
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