CR0402-LF Datasheet, PDF (1/2 Pages) Bourns Electronic Solutions – Chip Resistor

MATERIAL DECLARATION SHEET
Material Number
Product Line
Compliance Date
CR0402-LF
Chip Resistor
2010/08/16
RoHS Compliant
YES
MSL
1
No.
Construction
Element(subpart)
Homogeneous
Material
1 Ceramic Substrate Ceramic
Material
weight [g]
0.00043
2
Conductor Layer Conductor glass
0.000012
3 Resistive Element Resistor glass
0.000008
4
Over-Coating
Epoxy
0.00001
5
End Terminal
Nickel Chromium 0.000002
6
Ni Plating
Nickel
7
Sn Plating
Tin
0.00003
0.00002
Total weight 0.000512
This Document was updated on: 05.18.2010
Homogeneous
Material\
Substances
Aluminum oxide
Silicon dioxide
Silver
Bismuth trioxide
Barium oxide
Silicon dioxide
Boron oxide
Ruthenium
dioxide
Silver
Palladium
Lead oxide glass
Epoxy
Nickel
Chromium III
Nickel
Tin
CASRN
if applicable
1344-28-1
14808-60-7
7440-22-4
1304-76-3
1304-28-5
7631-86-9
1303-86-2
12036-10-1
7440-22-4
7440-05-3
1317-36-8
29690-82-2
7440-02-0
7440-47-3
7440-02-0
7440-31-5
Materials
Mass %
96%
4%
96%
1%
1%
1%
1%
25%
40%
15%
20%
100%
80%
20%
100%
100%
Material
Mass % of
total unit wt.
80.02%
3.33%
2.00%
0.0275%
0.0275%
0.0275%
0.0275%
0.41%
0.66%
0.25%
0.33%
2.03%
Subpart
mass of total
wt. (%)
83.35%
2.10%
1.64%
2.03%
0.29%
0.07%
5.56%
4.96%
0.36%
5.56%
4.96%
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