CM252016_MDS Datasheet, PDF (1/1 Pages) Bourns Electronic Solutions – CM252016 Series Wirewound Chip Inductor

MATERIAL DATA SHEET
Material
Product Line
Date
CM252016 Series
Wirewound Chip Inductor
19-July-2004
330K
No.
Construction
Element
1
Core
Material Group
Ferrite
2
Solder
Internal Connection
3
Pad
4 Solder Plate
5
Wire
6
Adhesive
7
Coating
Terminal Electrode
Terminal Solder
Coated Wire
Epoxy
Resin
Total Weight
Material
Weight (g)
0.005
0.001
0.005
0.001
0.006
0.001
0.004
0.023
Material
Copper (II) Oxide
Zinc Oxide
Nickel Oxide
Cobalttetraoxide
Ferric Oxide
Tin
Lead
Silver
Phosphor Bronze
Tin
Copper
Copper
Polyurethane Resin
Epoxy
Others
Epoxy Resin
Phenol Novolac
Antimony Trichloride
Brominated epoxy
Fused Silica
CAS
If applicable
1317-38-0
1314-13-2
1313-99-1
1308-06-1
1333-86-4
7440-31-5
7439-92-1
7440-22-4
-
7440-31-5
7440-58-8
7440-50-8
-
25068-38-6
-
29690-82-2
9003-35-4
1309-64-4
40039-93-8
60676-86-0
Average
Mass (%)
6
20
12
0.2
61.8
1
97.3
1.7
100
99.3
0.7
95
5
55
45
17.5
10
2.5
2.5
67.5
Sum
(%)
100
Remark
100
RoHS exempted: High-melting
point solder
100
100
100
100
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