CM201212_MDS Datasheet, PDF (1/2 Pages) Bourns Electronic Solutions – CM201212 Series Wirewound Chip Inductor

MATERIAL DECLARATION SHEET
Material
Product Line
Date
CM201212 Series
Wirewound Chip Inductor
27-April-2006
No.
Construction
Element
Material Group
1
Core
Bobbin
Material
Weight (g)
0.004
2
Solder
3
Pad
4 Solder Plate
5
Wire
6 Coating
Internal
Connection
Terminal
Electrode
Terminal
Solder
Coated Wire
Resin
0.0005
0.0015
0.0005
0.0005
0.003
Total Weight
0.010
Material
Polyester Resin
Glass
Teflon
Carbon Black
Tin
Lead
Phosphor Bronze
Tin
Copper
Copper
Polyurethane Resin
Epoxy Resin
Phenol Novolac
Antimony Trichloride
Brominated epoxy
Fused Silica
CAS
If applicable
60068-52-0
65997-17-3
9002-84-0
1333-86-4
7440-31-5
7439-92-1
-
7440-31-5
7439-92-1
7440-50-8
-
29690-82-2
9003-35-4
1309-64-4
40039-93-8
60676-86-0
Average
Mass (%)
69
30
0.5
0.5
14.5
85.5
100
Sum
(%)
100
Remark
100
RoHS exempted: High-melting
point solder
100
99.3
100
0.7
95
100
5
18
100
10
3
2
67
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