CM160808_MDS Datasheet, PDF (1/1 Pages) Bourns Electronic Solutions – CM160808 Series Chip Inductor

MATERIAL DECLARATION
Material Number
CM160808 Series
Product Line
Chip Inductor
Compliance Date
January 11, 2013
RoHS Compliant
Yes
MSL
1
No.
Construction Element
(subpart)
Homogeneous
Material
Material
weight
[mg]
1
Core
Alumina
2.39
2 Outer Packaging Resin Epoxy Resin
0.1
3
Coil / Electrode
Cu plating
1.26
4 Electrode base-Plating
Ni Plating
0.0044
5
Electrode Plating
Sn Plating
0.1226
Total weight
3.877
This Document was updated on: 2013/1/11
Homogeneous
Material\
Substances
Aluminum Oxide
Manganese Oxide
Crystalline Silica
Chromium (III) Oxide
Titanium Dioxide
Others
Epoxy Resin
Epoxy Resin
Silica
Others
Copper
Nickel
Tin
CASRN
if applicable
1344-28-1
1313-13-9
14808-60-7
1308-38-9
13463-67-7
-
29690-82-2
25068-38-6
14808-82-2
-
7440-50-8
7440-02-0
7440-31-5
Materials
Mass %
87.67
3.44
3.00
2.30
3.00
0.59
14.00
13.00
68.00
5.00
100.00
100.00
100.00
Important remarks: It is the responsibility of the user to verify they are accessing the latest version.
Material
Mass % of
total unit wt.
54.04
2.12
1.85
1.42
1.85
0.36
0.36
0.34
1.75
0.13
32.50
0.11
3.16
Subpart
mass of
total wt. (%)
61.28
2.94
32.50
0.11
3.16
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