CI160808_MDS Datasheet, PDF (1/1 Pages) Bourns Electronic Solutions – Multilayer Chip Bead

MATERIAL DATA SHEET
Material
Product Line
Date
CI160808 Series
Multilayer Chip Bead
04-December-2004
NO.
Construction
element
1
Ceramic Body
Material group
Ceramic
Material
Weight (g)
0.0024
2
Terminal
3
Solder Barrier
4
Solder
5
Circuit
Terminal
Electrode
Nickel
Tin
Silver
Total weight
0.00003
0.00003
0.00003
0.00051
0.003
Materials
SiO2
Al2O3
Ag
Ni
Sn
Ag
CAS
If applicable
------
------
7440-22-4
7440-02-0
7440-31-5
7440-22-4
Average mass
(%)
Business
Confidential
Sum (%)
100
1
100
1
1
100
17
100
Traces
Headquarters Riverside CA
www.bourns.com
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