CI160808 Datasheet, PDF (1/2 Pages) Bourns Electronic Solutions – Multi-Layer Chip Inductors

*RoHS ^COMPLIANT
Features
■ 0603 size
■ Available in E12 Series
■ High frequency
■ Nickel barrier
■ Lead free
Applications
■ Mobil phones
■ Cellular phones
■ CTV, VCR, HIC, FDD
■ Automotive electronics
CI160808 Series - Multi-Layer Chip Inductors
Electrical Specifications
Bourns Part No.
CI160808-1N0D
CI160808-1N2D
CI160808-1N5D
CI160808-1N8D
CI160808-2N2D
CI160808-2N7D
CI160808-3N3D
CI160808-3N9D
CI160808-4N7D
CI160808-5N6D
CI160808-6N8J
CI160808-8N2J
CI160808-10NJ
CI160808-12NJ
CI160808-15NJ
CI160808-18NJ
CI160808-22NJ
CI160808-27NJ
CI160808-33NJ
CI160808-39NJ
CI160808-47NJ
CI160808-56NJ
CI160808-68NJ
CI160808-82NJ
CI160808-R10J
CI160808-R12J
CI160808-R15J
CI160808-R18J
CI160808-R22J
CI160808-R27J
Inductance
Q Test Freq.
SRF MHz
DCR
I rms
nH
Tol. % min. L,Q MHz min.
typ. ohm max. mA max.
1.0 ±0.3 nH 8
100
4000 13000 0.10
300
1.2 ±0.3 nH 8
100
4000 13000 0.10
300
1.5 ±0.3 nH 8
100
4000 10000 0.10
300
1.8 ±0.3 nH 8
100
3800 10000 0.12
300
2.2 ±0.3 nH 8
100
3600 10000 0.16
300
2.7 ±0.3 nH 8
100
3400 8000
0.20
300
3.3 ±0.3 nH 10
100
3200 6000
0.22
300
3.9 ±0.3 nH 10
100
3000 6000
0.25
300
4.7 ±0.3 nH 10
100
2800 5000
0.28
300
5.6 ±0.3 nH 10
100
2700 5000
0.29
300
6.8
±5
10
100
2600 4000
0.30
300
8.2
±5
10
100
2200 4000
0.33
300
10
±5
10
100
1800 3000
0.35
300
12
±5
10
100
1650 2700
0.40
300
15
±5
10
100
1350 2400
0.45
300
18
±5
10
100
1350 2050
0.50
300
22
±5
10
100
1100 1850
0.55
300
27
±5
10
100
1100 1750
0.60
300
33
±5
10
100
1000 1500
0.65
300
39
±5
10
100
900 1350
0.70
300
47
±5
10
100
800 1200
0.90
300
56
±5
10
100
750 1150
1.00
300
68
±5
10
100
700 1000
1.20
300
82
±5
10
100
600 900
1.50
300
100
±5
10
100
500 850
1.70
300
120
±5
8
50
500 850
2.00
250
150
±5
8
50
500 680
2.40
200
180
±5
8
50
400
60
2.70
200
220
±5
8
50
350 500
2.80
200
270
±5
8
50
300 450
3.10
200
Packaging Specifications
178.0
(7.00) ^DIA.
2.0 ± 0.5
(.079 ± .020)
12.0
(.472)
21.0 ± 0.8
(.827 ± .031)
(.51132.0±±.002.50) ^DIA.
13.0 ± 0.5
(.512 ± .020)
DIA.
50.0
(1.969)
9.0
(.354)
General Specifications
Temperature Rise
...................20 ˚C max. at rated current
Operating Temperature .-55 °C to +125 °C
Storage Temperature..-55 °C to +125 °C
Reflow Soldering ...230 °C, 50 sec. max.
Resistance to Soldering Heat
...............................260 ˚C, 10 seconds
Materials
Base Material .............................Ceramic
Terminal .....................................Ag/Ni/Sn
Packaging..................4,000 pcs. per reel
Product Dimensions
0.5
(.020)
MAX.
1.6 ± 0.15
(.063 ± .006)
0.8 ± 0.15
(.031 ± .006)
0.8 ± 0.15
(.031 ± .006)
DIMENSIONS:
MM
(INCHES)
Recommended Layout
1.0
(.039)
REF.
1.0
(.039)
REF.
1.3
(.051)
REF.
0.5
(0.02) ^REF.
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.