CE2012_MDS Datasheet, PDF (1/1 Pages) Bourns Electronic Solutions – Ceramic Chip Inductor

MATERIAL DECLARATION SHEET
Material #
Product Line
Date
Rev., date
CE2012 Series (C=0.85)
Ceramic Chip Inductor
March 2005
NO.
Construction
element
Material group Material
Weight [g]
Materials
1
Core
Ferrite
0.00561
Alumina
Silica
2
Pad
Terminal
Electrode
0.00077
Ag (>5um)
Ni (>1.5um)
3
Solder plate
Solder plate 0.000165
Sn (>3um)
4
Circuit
Silver
0.0000528
Ag
Total weight
0.0066
CAS
If applicable
Average mass
[%]
Sum [%]
------
Business
100
15468-32-3 ^Confidential
7440-22-4
67
100
7440-02-0
33
7440-31-5
100
7440-22-4
100
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