CE201210_12 Datasheet, PDF (1/2 Pages) Bourns Electronic Solutions – Multi-Layer Chip Inductors

*RoHS ^COMPLIANT
Features
■ 0805 size
■ Available in E12 Series
■ High frequency
■ Nickel barrier
■ RoHS compliant*
Applications
■ Mobile phones
■ Cellular phones
■ CTV, VCR, HIC, FDD
■ Automotive electronics
CE201210 Series - Multi-Layer Chip Inductors
Electrical Specifications
Bourns
Part No.
Inductance
nH Tol. %
Q
Typ.
Test
Frequency
@100 MHz L MHz
CE201210-1N5D 1.5 ± 0.3 nH
21
100
CE201210-1N8D 1.8 ± 0.3 nH
18
100
CE201210-2N2D 2.2 ± 0.3 nH
18
100
CE201210-2N7D 2.8 ± 0.3 nH
19
100
CE201210-3N3J 3.3
±5
16
100
CE201210-3N9J 3.9
±5
18
100
CE201210-4N7J 4.7
±5
18
100
CE201210-5N6J 5.6
±5
20
100
CE201210-6N8J 6.8
±5
20
100
CE201210-8N2J 8.2
±5
21
100
CE201210-10NJ 10
±5
20
100
CE201210-12NJ 12
±5
21
100
CE201210-15NJ 15
±5
22
100
CE201210-18NJ 18
±5
24
100
CE201210-22NJ 22
±5
23
100
CE201210-27NJ 27
±5
23
100
CE201210-33NJ 33
±5
24
100
CE201210-39NJ 39
±5
23
100
CE201210-47NJ 47
±5
23
100
CE201210-56NJ 56
±5
23
100
CE201210-68NJ 68
±5
25
100
CE201210-82NJ 82
±5
24
100
CE201210-R10J 100
±5
23
100
CE201210-R12J 120
±5
22
50
CE201210-R15J 150
±5
22
50
CE201210-R18J 180
±5
23
50
CE201210-R22J 220
±5
20
50
CE201210-R27J 270
±5
20
50
CE201210-R33J 330
±5
22
50
CE201210-R39J 390
±5
17
50
CE201210-R47J 470
±5
17
50
SRF
MHz
Min.
4000
4000
4000
4000
4000
4000
3500
3200
2800
2400
2100
1900
1600
1500
1400
1300
1200
1000
900
800
700
600
600
500
500
400
350
300
250
250
200
Packaging Specifications
178.0
(7.00)
DIA.
2.0 ± 0.8
(.079 ± .031)
12.0
(.472)
DCR
mohm
Max.
100
100
100
100
130
150
200
230
250
280
300
350
400
450
500
550
600
650
700
750
800
900
900
950
1000
1100
1200
1300
1400
1300
1500
I rms
mA
Max.
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
General Specifications
Temperature Rise
.................30 °C max. at rated current
Operating Temperature
................................-55 °C to +125 °C
Storage Temperature
................................-55 °C to +125 °C
Reflow Soldering .. 230 °C, 50 sec. max.
Resistance to Soldering Heat
................................... 260 °C, 10 sec.
Materials
Base Material.............................Ceramic
Terminal ....................................Ag/Ni/Sn
Packaging:
CE201210-1N5D
through
CE201210-82NJ.... 4,000 pcs. per reel
CE201210-R10J
through
CE201210-R27J.... 4,000 pcs. per reel
CE201210-R33J
through
CE201210-R47J.... 2,000 pcs. per reel
Product Dimensions
0.5 ± 0.3
(0.02 ± 0.008)
2.0 ± 0.2
(.079 ± .008)
A ± 0.20
(A ± 0.008)
1.25 ± 0.2
(.049 ± 0.08)
Model
CE201210-15ND through
CD201210-82NJ
CE201210-R10J through
CE201210-R39J
CE201210-R47J
Dimension A
0.83
(0.033)
1.00
(0.039)
1.25
(0.050)
Recommended Layout
3.0
(.118)
21.0 ± 0.8
(.827 ± .031)
13.5 ± 0.5
(.531 ± .020)
DIA.
13.0 ± 0.5
(.512 ± .020)
DIA.
60.0
(2.362)
9.0
(.354)
1.0
(.039)
1.0
(.039)
DIMENSIONS:
MM
(INCHES)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and
RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.