CDSOT23_MDS Datasheet, PDF (1/2 Pages) Bourns Electronic Solutions – CDSOT23 Series Diode Products

MATERIAL DECLARATION SHEET
Material Number
CDSOT23 Series
Product Line
Compliance Date
Diode Products
1 Jan 2006
RoHS Compliant
Yes
MSL
1
No.
Construction
Element(subpart)
Homogeneous
Material
Material
weight [g]
1
Lead Frame
Lead Frame
0.0257
2
Die
Silicon
3
Gold Bond Wire
Conductor
4
Silver Paste
Die Attach
0.014340
0.000352
0.000808
5
Molding
Component
Outer
0.018840
Total weight
0.060000
This Document was updated on: 18-March 2009
Homogeneous
Material\
Substances
Copper
Tin
Silicon
Other non-
regulated
materials
Gold
Tin
CASRN
if applicable
7440-50-8
7440-31-5
7440-21-3
7440-57-5
7440-31-5
Silver
7440-22-4
Copper
Silica fused
Brominated Epoxy
resin
Phenol resin
7440-50-8
60676-86-0
68928-70-1
29690-62-2
Materials
Mass %
95
5
97
3
100
96
3.5
0.5
85
10
5
Material
Mass % of
total unit wt.
40.770
2.0600
23.420
Subpart
mass of total
wt. (%)
42.8
0.4780
23.9
0.5867
0.6
1.05
0.235
1.3
0.075
26.690
3.1400
31.4
1.8840
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