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CDDFN10-0516P Datasheet, PDF (1/6 Pages) Bourns Electronic Solutions – Surface Mount TVS Diode Array
*RoHS COMPLIANT
Features
n RoHS compliant*
n Low capacitance - 0.02 pF (I/O to I/O)
nESD protection to IEC 61000-4-2 (Level 4)
Applications
n USB 3.1
n USB 3.0
LEAD FREE
CDDFN10-0516P - Surface Mount TVS Diode Array
General Information
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2
5V
3.3 V
2.2 V
1
10
4
5
6
7
The DFN10 packaged device has an ultra-low typical capacitance
of only 0.02 pF between I/O lines. This allows it to be used for
9
protecting sensitive components used on high-speed interfaces.
The small footprint of the device allows for flow-through routing
on the PCB, helping to maintain matched impedances of the
high-speed data lines.
Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Peak Pulse Current (tp = 8/20 μS) (1)
ESD (per IEC 61000-4-2 Contact)
ESD (per IEC 61000-4-2 Air)
Operating Temperature
Storage Temperature
Symbol
Ipp
TJ
TSTG
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Pin 2 (VBUS) to Ground
Parameter
Symbol
Working Peak Reverse Voltage
VWM_BUS
Breakdown Voltage @ 1 mA
VBR_BUS
Snap-back Voltage @ 50 mA
VSB_BUS
Leakage Current @ VWM_BUS
IR_BUS
Clamping Voltage @ IPP = 4 A
VC_BUS
Channel Capacitance @ 0 V, 1 MHz
CIN_BUS
Pin 1 or 10 (D+, D-) to Ground (Unless Otherwise Noted)
Parameter
Symbol
Working Peak Reverse Voltage
Breakdown Voltage @ 1 mA
Snap-back Voltage @ 50 mA
Leakage Current @ VWM_USB
Forward Voltage @ 15 mA
Clamping Voltage @ IPP = 4 A
Channel Capacitance @ 1.65 V, 1 MHz
Channel to Channel Capacitance
@ 1.65 V, 1 MHz (2) (3)
VWM_USB
VBR_USB
VSB_USB
IR_USB
VF_USB
VC_USB
CIN_USB
CCROSS_USB
Min.
6
5.5
Min.
4.5
3.6
Note 1: Pin 2 (VBUS) to Ground
Note 2: Between Pins 1 and 10 (D+ to D-)
Note 3: Pin 9 = 0 V
CDDFN10-0516P
Unit
4
A
10
kV
15
kV
-40 to +85
ºC
-55 to +150
ºC
Typ.
Max.
Unit
5
V
V
V
2.5
μA
6.5
V
17
22
pF
Typ.
Max.
Unit
3.3
V
V
V
1
μA
0.9
V
7.2
V
0.35
0.5
pF
0.02
0.04
pF
(Continued on next page)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.