CD-MBL2XXS Datasheet, PDF (1/4 Pages) Bourns Electronic Solutions – Surface Mount Bridge Rectifier Diode

*RoHS ^COMPLIANT
Features
n RoHS compliant*
n Low power loss and high efficiency
nHigh current capability
n Low profile package
Applications
n AC operated products
n Computer monitors
n Set-top boxes
nCable modems
LEAD ^FREE
CD-MBL2xxS(L) Series Surface Mount Bridge Rectifier Diode
General Information
cc_B^Thoh_oame_ul_rlpme_nons^angr_oekinfnefg_ettssrt_s.hoeB^f _r^ps_id^oe_g^rmt_e^aicb_Role_en_cdc_tuo_ifcm_ieto_r^mr_D^uin_iⁿ_odi_d^cu_e^as_s^ttior_fy_oⁿ_r^sto,_LrVEReE^cd_AoRcDH^oe_SSt^FIm_Ov_i^RC_fNEOe_iSE^p_cMl^A_aP^uoRLE_t^tpIA_iⁱ_o^nNi^T_n^gn* c_a^ar_p^ne_p^da_ls_i^v_cini_a^dg_t^e_il_oyo_nse_smq_i^u_nailp_clem_or_m^een_plet_aca_ct_trroe_cn_hi_ic_{p package}
0.23 ˝ x 0.20 ˝ size format, which offers PCB real estate savings and are considerably smaller
than standard parts. The Bridge Rectifier Diodes offer a forward current of 2 A with a choice
of repetitive peak reverse voltages between 600 V and 1000 V.
4
1
–
+
~
~
3
2
Absolute Maximum Ratings (@ T_A = 25 °C Unless Otherwise Noted)
Parameter
Maximum Repetitive
Peak Reverse Voltage
Maximum Average Forward Rectified
Current (T_A = 55 °C)
Peak Forward Surge Current 8.3 ms
Single Half Sine-Wave Superimposed
on Rated Load (JEDEC Method)
Operating Temperature Range
Storage Temperature Range
Symbol
CD-
Unit
MBL206S MBL208S MBL210S MBL206SL MBL208SL MBL210SL
VRRM
600
800
1000
600
800
1000
V
IF(AV)
2.0
A
IFSM
50.0
60.0
A
TJ
-55 to +175
°C
TSTG
-55 to +175
°C
Electrical Characteristics (@ T_A = 25 °C Unless Otherwise Noted)
Parameter
Instantaneous Forward Voltage
Repetitive Peak Reverse Current
Junction Capacitance
Thermal Resistance, Junction to Air ⁽¹⁾
Thermal Resistance, Junction to Lead ⁽¹⁾
Symbol
VF
IRRM
CJ
R_ΘJA
R_ΘJL
CD-MBL2xxS(L)
Test Conditions
Min.
IF = 2 A
CD-MBL2xxS
CD-MBL2xxSL
VR = VRRM TA = +25 °C
VR = 4 V, ^CD-MBL2xxS
f = 1.0 MHz _CD-MBL2xxSL
CD-MBL2xxS
CD-MBL2xxSL
CD-MBL2xxS
CD-MBL2xxSL
Typ.
0.95
0.94
0.08
25
35
95
95
15
15
NOTE 1: Measured when mounted on PCB with 5.0 mm x 5.0 mm (0.2 “ x 0.2 “) copper pad areas.
Max.
1.0
0.96
5.0
Unit
V
µA
pF
°C / W
°C / W
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.