CAY10-330J4LF Datasheet, PDF (1/3 Pages) Bourns Electronic Solutions – Model CAY10 - Chip Resistor Array

*RoHS ^COMPLIANT
Features
■ RoHS compliant*
■ 2/4 isolated resistors in an 0404/0804 size
package
■ E24 series from 10 ohms to 1 megohm
■ Convex termination style
■ Resistance tolerance ±5 %
■ Suitable for all types of soldering processes
■ Paper tape on reel for automatic placement
Model CAY10 - Chip Resistor Array
Specifications
Requirement
Short Time Overload
Soldering Heat
Temperature Cycling (5)
Moisture Load Life
Load Life
Characteristics
±2 %
±1 %
±1 %
±3 %
±3 %
Test Method
Rated Voltage X 2.5, 5 seconds
260 °C ±5 °C, 10 seconds ±1 second
125 °C (30 minutes) - normal (15 minutes)
-30 °C (30 minutes) - normal (15 minutes)
1000 hours
1000 hours
Characteristics
Characteristics
Number of Elements (Isolated)
Power Rating @ 70 °C per Resistor
Package Power Rating @ 70 °C
Resistance Tolerance
Resistance Range (E24)
plus Zero-ohm Jumper
T.C.R.
Max. Overload Voltage
Max. Working Voltage
Operating Temp. Range
Rating Temperature
Packaging
CAY10-xxxJ2
2
31 mW
63 mW
CAY10-xxxJ4
4
63 mW
125 mW
±5 %
10 ohms - 1 megohm
±250 ppm/°C
50V
25V
-55 °C to +125 °C
+70 °C
10,000 pieces per reel
How To Order
CA Y 10 - 103 J 4 LF
Chip Arrays
Type
• Y = Convex
Model
• 10 = 04 Package Width
Resistance Code
• 103 = 10 K ohms
• 000 = Zero-ohm Jumper
Resistance Tolerance
• J = ±5 %
Resistors
• 2 = 2 Resistors
• 4 = 4 Resistors
Terminations
• LF = Tin-plated (RoHS compliant)
For Standard Values Used in Capacitors,
Inductors, and Resistors, click here.
Construction
Protective Glass Overcoat
Thick Film
Resistive Element
Termination
High Purity Alumina
Substrate
Derating Curve
70 °C
125 °C
100
80
60
40
20
0
-55
40 60 80 100 120 140 160
Ambient Temp. (˚C)
Typical Part Marking
None on part. Label on reel will include
part number.
Isolated Circuit
CAY10-xxxJ2
4
3
R
R
1
2
CAY10-xxxJ4
8
7
6
5
R
R
R
R
1
2
3
4
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.