CAT16-PC5F12LF Datasheet, PDF (1/1 Pages) Bourns Electronic Solutions – Concave Chip Array

*RoHS ^COMPLIANT
Features
■ HIGH PERFORMANCE TERMINATION
NETWORK
■ Miniaturized circuitry and packaging
for space reduction
■ Designed for gigabit communication
networks
■ Controlled impedance
■ RoHS compliant*
CAT16-PC5F12LF - Concave Chip Array
Electrical Characteristics
Resistance
R1 ...............................................70 ohms
R2 .............................................187 ohms
Tolerance ............................................±1 %
TCR........................................±200 ppm/ ˚C
Temperature Range .........-55 ˚C to +125 ˚C
Max. Operating Voltage ....................5 VDC
Max. Power Resistance ................ .0625 W
Solderability .....................>95 % Coverage
For Standard Values Used in Capacitors,
Inductors, and Resistors, click here.
Product Dimensions
.60 ± .10
(.024 ± .004)
.45 ± .10
16
15
14
13 12
11
10
9
.30
(.012
±
±
.10
.004)
DIA.
(.018 ± .004)
1.60 ± .15
(.063 ± .060)
.40 ± .10
(.016 ± .004)
.80 ± .10
(.031 ± .004)
6.40 ± .15
(.253 ± .006)
1 2 34 5 6 78
DIMENSIONS ARE:
MM
(INCHES)
.40 ± .10
(.016 ± .004)
Packaging Specifications
4000 pcs - per 7 " reel
0.9 ± 0.1
(.035 ± .004)
2.00 ± 0.20
(.079 ± .008)
6.9 ± 0.2
(.272 ± .008)
4.0 ±.10
(.158 ±.004)
4.0 ± .10
(.157 ± .004)
2.0 ± .05
(.079 ± .002)
1.5 +.10/-0
(.060 +.004/-0)
5.5 ± 0.1
(.217 ± .004) _{12.0 ± 0.2}
(.472 ± .008)
1.75 ± .10
(.069 ± .004)
21 ± 0.5
(.827 ± .020)
15.4 ± 1.0
(.606 ± .039)
13
(.512
±
±
0.5
.020)
DIA.
60.0 ± 1.0
(2.36 ± .039)
DIA.
178.0 ± 2.0
(7.008 ± .080)
13.0 ± 0.3
(.512 ± .012)
Derating Curve
100
80
60
40
20
0
-55
0
70
125
(ϒC) Ambient temperature
Schematic
16 15 14 13 12 11 10 9
R2
R1 R1
R2
R1 R1
R2
R1 R1
R2
R1 R1
1 2 3 4 56 7 8
Land Pattern
0.7 to 0.9
(.028 to .035)
2.0 to 2.2
(.079 to .087)
0.4 to 0.45
(.016 to .0178)
0.80
(.032)
Solder resist
Land
Chip resistor array CAT
11/06
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.