CAT16-LV4F12LF Datasheet, PDF (1/1 Pages) Bourns Electronic Solutions – Concave Chip Array

*RoHS ^COMPLIANT
Features
■ HIGH PERFORMANCE TERMINATION
NETWORK
■ Miniaturized circuitry and packaging
for space reduction
■ Designed for gigabit communication
networks
■ Controlled impedance
■ RoHS compliant*
CAT16-LV4F12LF - Concave Chip Array
Electrical Characteristics
Resistance
R1 .............................................165 ohms
R2 .............................................140 ohms
Tolerance ............................................±1 %
TCR........................................±200 ppm/ ˚C
Temperature Range .........-55 ˚C to +125 ˚C
Max. Operating Voltage ....................5 VDC
Max. Power Resistance ................ .0625 W
Solderability .....................>95 % Coverage
For Standard Values Used in Capacitors,
Inductors, and Resistors, click here.
Product Dimensions
.60 ± .10
(.024 ± .004)
.45 ± .10
16
15
14
13 12 11
10
9
.30
(.012
±
±
.10
.004)
DIA.
(.018 ± .004)
1.60 ± .15
(.063 ± .060)
.40 ± .10
(.016 ± .004)
.80 ± .10
(.031 ± .004)
6.40 ± .15
(.253 ± .006)
1 2 34 5 6 78
DIMENSIONS ARE:
MM
(INCHES)
.40 ± .10
(.016 ± .004)
Packaging Specifications
4000 pcs - per 7 " reel
0.9 ± 0.1
(.035 ± .004)
2.00 ± 0.20
(.079 ± .008)
6.9 ± 0.2
(.272 ± .008)
4.0 ±.10
(.158 ±.004)
4.0 ± .10
(.157 ± .004)
2.0 ± .05
(.079 ± .002)
1.5 +.10/-0
(.060 +.004/-0)
5.5 ± 0.1
(.217 ± .004) _{12.0 ± 0.2}
(.472 ± .008)
1.75 ± .10
(.069 ± .004)
21 ± 0.5
(.827 ± .020)
12.5 ± 2
(.492 ± .079)
13
(.512
±
±
0.5
.020)
DIA.
60.0 ± 1.0
(2.36 ± .039)
DIA.
178.0 ± 2.0
(7.008 ± .080)
10.0 ± 1.5
(.394 ± .059)
Derating Curve
100
80
60
40
20
0
-55
0
70
125
(°C) Ambient temperature
Land Pattern
0.7 to 0.9
(.028 to .035)
2.0 to 2.2
(.079 to .087)
Solder resist
Land
Chip resistor array CAT
Schematic
16 15 14 13 12 11 10 9
R2
R1 R1
R2
R1 R1
R2
R1 R1
R2
R1 R1
1 2 3 4 56 7 8
0.4 to 0.45
(.016 to .0178)
0.80
(.032)
REV. 11/06
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.