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70ABJ-4-M0E Datasheet, PDF (1/2 Pages) Bourns Electronic Solutions – 70AB/Male - Modular Contact
*RoHS COMPLIANT
Features
■ 1.27 mm pitch
■ 3 to 4 precious metal contacts
■ Twin hot contacts (symmetrical pad layout)
■ Pick & place compatible
■ High cycle life
■ RoHS compliant*
Applications
■ Handheld communications - mobile
phones, pagers, cordless phones, GPS,
PICs, radios
■ Portable consumer equipment - PDAs,
HPCs, notebook PCs, cameras,
dictaphones, PICs, games
70AB/Male - Modular Contact
Material & Finishes
Product Dimensions
Insulator ....Glass reinforced thermoplastic,
70ABJ
UL 94V-0 rated, black
A
Contact ...................................Copper alloy
Finish
Underplating.......................20 ohms max.
Contact Area....................2 % max. of TR
Operating Characteristics
Electrical
Current Rating ........................3 A/contact
Voltage Rating....................................60 V
Contact Resistance......25 milliohms max.
Dielectric Voltage .......................AC 500 V
Insulating Resistance ...1000 Mohms min.
Operating Temperature ..-55 °C to 125 °C
Mechanical
Normal Force/Finger ..........40 grams min.
Durability .......................5,000 cycles min.
0.46
(.018)
5.00
(.197)
How to Order
70AB J - 4 - M 0 E
Model
Terminal Style
Number of Contacts (N)
3 or 4
Gender
M = Male
Options
0 = Standard
Packaging Option
E = Embossed Tape (500 pcs. per reel)
0.13
(.005)
1.27 CONTACT SPACING
(.050)
1.05
(.041)
1.98
(.078)
3.44
(.135)
Recommended PWB Layout
TYP.
B
NON-ACCUM.
1.27
(.050)
TYP.
0.71
(.028)
5.59
(.220)
1.27
(.050)
TYP.
Number of
Contacts
3
4
Dimension
B
5.79
(.288)
7.06
(.278)
DIMENSIONS ARE: MILLIMETERS
(INCHES)
Asia-Pacific:
Tel: +886-2 2562-4117
Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555
Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500
Fax: +1-951 781-5700
www.bourns.com
0.46
(.018)
Number of
Contacts
3
4
Dimension
A
4.39
(.173)
5.66
(.223)
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.