2FAH-C20R Datasheet, PDF (1/4 Pages) Bourns Electronic Solutions – Integrated Passive & Active Device using CSP

*RoHS ^{VCEOARMVSAPIOILLINAASBNLTE}
Features
■ Lead free versions available
■ RoHS compliant (lead free version)*
■ New Product Development
■ Integrated Passive Device
■ ESD Protection to IEC61000-4-2 Spec.
2FAH-C20R Series - Integrated Passive & Active Device using CSP
General Information
This application specific integrated passive component is
designed to provide all of the necessary ESD protection
and line resistance required on the data port of a custom
portable electronic device. The ESD protection provided by
the component enables the data port to withstand ±8 KV
Contact / ±15 KV Air Discharge when tested according to
the method specified in IEC 61000-4-2. The component
incorporates 7 identical channels and is supplied in a 20
pin CSP package which is intended to be mounted
directly onto an FR4 printed circuit board. This package
will meet typical thermal cycle and bend test specifica-
tions without the use of an underfill material.
SOLDER
BUMPS
SILICON
DIE
Figure 1 – CSP Format
Electrical & Thermal Characteristics
Electrical Characteristics
(T_A = 25 °C unless otherwise noted)
Zener Diode
Breakdown Voltage @ 1 mA
Leakage Current @ 3 V
ESD Performance (Note 1)
Withstand
Contact Discharge
Air Discharge
Let Through (Note 2)
Contact Discharge
Air Discharge
Channel Specification
Resistance
Capacitance @ 1 V & 1 MHz
Thermal Characteristics
(T_A = 25 °C unless otherwise noted)
Operating Temperature
Storage Temperature
Total Power Dissipation @ 70 °C
Symbol
V_BR
I_R
R
C
T_J
T_stg
P_D
Minimum
6
±8
±15
90
8.5
-40
-60
Nominal
7.2
Maximum
8
1
±150
±150
100
110
10.5
12.5
25
+85
25
+125
100
Unit
V
µA
kV
kV
V
V
Ω
pF
°C
°C
mW
Note:
1. The IEC 61000-4-2 test method will be adapted for component level testing. The device will provide the specified ESD protection
performance on the “IN 1-7” pins only.
2. “Let Through” is a measure of the component of an incident ESD transient that the protection device allows through to the down
stream circuitry.
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.