2FAB-M20R Datasheet, PDF (1/4 Pages) Bourns Electronic Solutions – Integrated Passive & Active Device using MLP

*RoHS ^COMPLIANT
Features
■ Lead free as standard
■ RoHS compliant*
■ ESD protection
■ Protects up to ten data lines
■ Low insertion loss
Applications
■ Cell Phones
■ PDAs and Notebooks
■ GPS and SMART Cards
2FAB-M20R – Integrated Passive & Active Device using MLP
General Information
The 2FAB-M20R device, manufactured using Thin Film on
Silicon technology, provides ESD protection for the external
ports of portable electronic devices such as cell phones,
modems and PDAs.
The ESD protection provided by the component enables a
data port to withstand a minimum ±8 KV Contact /±15 KV Air
Discharge per the ESD test method specified in IEC 61000-4-2.
The device measures 3.5 mm x 3.5 mm and is intended to be
mounted directly onto an FR4 printed circuit board. The MLP
device meets typical thermal cycle and bend test specifications.
GROUND
PAD
MLP
PACKAGE
I/O PADS
Electrical & Thermal Characteristics
Electrical Characteristics
(TA = 25 °C unless otherwise noted)
Resistance
Capacitance @ 2.5 V 1 MHz
Rated Standoff Voltage
Breakdown Voltage @ 1 mA
Forward Voltage @ 10 mA
Leakage Current @ 3 V
ESD Protection: IEC 61000-4-2
Contact Discharge
Air Discharge
Thermal Characteristics
(TA = 25 °C unless otherwise noted)
DC Power Rating
Operating Temperature Range
Storage Temperature Range
Symbol
R
C
VWM
VBR
VF
ID
Minimum
90
16
6.0
±8
±15
Nominal
100
20
5.0
0.8
Maximum
110
24
0.1
P
100
TJ
-40
25
+85
TSTG
-55
25
+150
Unit
Ω
pF
V
V
V
µA
kV
kV
mW
°C
°C
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.