2DTF Datasheet, PDF (1/3 Pages) Bourns Electronic Solutions – Thin Film On Silicon 2DTF 1284 Terminator/Filter with Integrated ESD Array

*RoHS ^{VCEOARMVSAPIOILLINAASBNLTE}
Features
■ Lead free versions available
■ RoHS compliant (lead free version)*
■ Combined EPP/ECP parallel port
terminator and filter with an integrated
diode array
■ Complete interface solution - two
packages replace 61 discrete elements
■ Nine termination channels per package
■ Supports IEC 61000-4-2 ESD
specification requirements*
Thin Film On Silicon 2DTF 1284 Terminator/Filter with Integrated ESD Array
General Information
The Model 2DTF Series IEEE 1284 Terminator/Filter is a
multi-functional single device interface for IEEE EPP/ECP
designs. In addition to termination and filtering, the Model
2DTF offers ±8 KV contact discharge and ±15 KV air
discharge (per Human Body model) of ESD protection and is
specifically designed to meet the requirements of ESD
system specification IEC 61000-4-2.
This highly integrated product is well-suited for use in space-
constrained applications such as PC notebooks and
motherboards, NT servers, engineering workstations, and
portable battery powered devices. It is also useful in
peripheral products which are designed to communicate
through the EPP/ECP parallel port such as inkjet and laser
printers, portable/removable drives, scanners, digital
cameras, tape back-ups, LANs and other communication
interfaces.
Package Schematic
GND Vcc
GND
24 23 22 21 20 19 18 17 16 15 14 13
R1
R2
1 2 3 4 5 6 7 8 9 10 11 12
GND GND
GND
Electrical & Environmental Characteristics
Electrical Characteristics
Resistor Tolerance
Resistor Power Dissipation @ 70 °C
Capacitor Tolerance
Capacitor Breakdown Voltage
Maximum Operating Voltage
Forward Voltage:
@If = 1 mA
@If = 10 mA
Reverse Breakdown Voltage:
@IR = 10 µA @ 70 °C
@IR = 1 µA @ 25 °C
Max. Leakage Current @ Max. Vcc @ 25 °C
Signal Clamp Voltages:
Positive Clamp
Negative Clamp
Environmental Characteristics
Operating Temperature
Storage Temperature
Diode Power Rating
ESD Performance Withstand*:
Contact Discharge
Air Discharge
Symbol
Vcc
Vf
Vf
RV
RV
TJ
Tstg
Minimum
25
6 ± 0.5
6 ± 0.5
-55
-65
±8
±15
Nominal
35
0.65
±9
±16
Maximum
±10
100
±20
6.0
0.9
1.5
0.85
1
6
-6
+125
+150
20
Unit
%
mW
%
V
V
V
V
V
V
µA
V
V
°C
°C
mW/diode
kV
kV
* Note: IEC 61000-4-2 ESD test performance is measured at the systems level and system designs, enclosure shielding and other conventional ESD control measures usually influence the
results of these tests. Testing on the component level serves as an indicator that the system passes a specific compliance step, but does not ensure that the system passes at that level. The
Model 2DTF device, therefore, can support successful implementation of the IEC 61000-4-2 system level ESD standard.
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.