2DAD-C5R Datasheet, PDF (1/4 Pages) Bourns Electronic Solutions – Integrated Passive & Active Device using CSP

*RoHS ^{VCEOARMVSAPIOILLINAASBNLTE}
Features
■ Lead free versions available
■ RoHS compliant (lead free version)*
■ ESD protection
■ Protects four lines
■ Low capacitance 15 pF
Applications
■ Cell phones
■ PDAs and notebooks
■ MP3 players
2DAD-C5R - Integrated Passive & Active Device using CSP
General Information
The 2DAD-C5R device, manufactured using Thin Film on
Silicon technology, provides ESD protection for the
external ports of portable electronic devices such as cell
phones, modems and PDAs.
The ESD protection provided by the component enables
a data port to withstand a minimum ±8 KV Contact /
±15 KV Air Discharge per the ESD test method specified
in IEC 61000-4-2. The device measures 1.00 mm x 1.33
mm and is available in a 5 bump CSP package intended
to be mounted directly onto an FR4 printed circuit board.
The CSP device meets typical thermal cycle and bend test
specifications without the use of an underfill material.
Electrical & Thermal Characteristics
Electrical Characteristics
(T_A = 25 °C unless otherwise noted)
Capacitance @ 2.5 V 1 MHz
Rated Standoff Voltage
Breakdown Voltage @ 1 mA
Forward Voltage @ 10 mA
Leakage Current @ 3.3 V
ESD Protection: IEC 61000-4-2
Contact Discharge
Air Discharge
Thermal Characteristics
(T_A = 25 °C unless otherwise noted)
DC Power Rating
Operating Temperature Range
Storage Temperature Range
Symbol
C
V_WM
V_BR
V_F
I_R
P
T_J
T_STG
SOLDER
BUMPS
SILICON
DIE
Minimum
12
6.0
±8
±15
Nominal
15
5.0
0.8
Maximum
18
0.1
200
-40
25
+85
-55
25
+150
Unit
pF
V
V
V
µA
kV
kV
mW
°C
°C
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.