2DAC-C16R Datasheet, PDF (1/4 Pages) Bourns Electronic Solutions – Integrated Passive & Active Device using CSP

*RoHS ^{VCEOARMVSAPIOILLINAASBNLTE}
Features
■ Lead free versions available
■ RoHS compliant (lead free version)*
■ New Product Development
■ Integrated Passive Device
■ ESD Protection to IEC61000-4-2 Spec.
2DAC-C16R Series - Integrated Passive & Active Device using CSP
General Information
This application specific integrated passive component is
designed to provide all of the necessary ESD protection
on the data port of a portable electronic device. The ESD
protection provided by the component enables the data
port to withstand ±8 KV Contact / ±15 KV Air Discharge
when tested according to the method specified in IEC
61000-4-2. The component incorporates 12 identical ports
and is supplied in a 16 pin CSP package which is intended
to be mounted directly onto an FR4 printed circuit board.
This package is designed to meet typical thermal cycle
and bend test specifications without the use of an
underfill material.
SOLDER
BUMPS
SILICON
DIE
Figure 1 – CSP Format
Electrical & Thermal Characteristics
Electrical Characteristics
(T_A = 25 °C unless otherwise noted)
Zener Diode
Breakdown Voltage @ 1 mA
Leakage Current @ 3 V
Diode Capacitance @ 1 V & 1 MHz
ESD Performance (Note 1 & 2)
Withstand
Contact Discharge
Air Discharge
Let Through
Contact Discharge
Air Discharge
Thermal Characteristics
(T_A = 25 °C unless otherwise noted)
Operating Temperature
Storage Temperature
Total Power Dissipation @ 70 °C
Symbol
V_BR
I_R
C_T
Minimum
6
8.5
±8
±15
Nominal
7.2
10.5
Maximum
8
1
12.5
±150
±150
T_J
-40
T_stg
-60
P_D
25
+85
25
+125
100
Unit
V
uA
pF
kV
kV
V
V
°C
°C
mW
Note:
1. The IEC 61000-4-2 test method will be adapted for component level testing. The device will provide the specified ESD protection
performance on the “EXT1 – 12” pins only.
2. “Let Through” is a measure of the component of an incident ESD transient that the protection device allows through to the down
stream circuitry.
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.