2DAB-F6R Datasheet, PDF (1/4 Pages) Bourns Electronic Solutions – Integrated Passive & Active Device

*RoHS ^{VCEOARMVSAPIOILLINAASBNLTE}
Features
■ Lead free versions available
■ RoHS compliant (lead free version)*
■ ESD protection > 25k volts
■ Protects five unidirectional lines or four
bidirectional lines
■ Small SMT package
Applications
■ Cell phones
■ PDAs and notebooks
■ Digital cameras
■ MP3 players and GPS
2DAB-F6R - Integrated Passive & Active Device
General Information
The 2DAB-F6R device provides ESD protection for the
I/O port of portable electronic devices such as cell
phones, modems and PDAs. The device incorporates five
TVS diodes which can be configured as five unidirectional
lines or four bidirectional lines for interfacing to external
lines.
The ESD protection provided by the component enables
an I/O port to withstand a minimum ±8 KV Contact / ±15 KV
Air Discharge per the ESD test method specified in IEC
61000-4-2. The device measures 1.00 mm x 1.50 mm and
is available in a 6 bump Flip Chip package intended to be
mounted directly onto an FR4 printed circuit board. The
Flip Chip device meets typical thermal cycle and bend test
specifications without the use of an underfill material.
SOLDER
BUMPS
SILICON
DIE
Electrical & Thermal Characteristics
Electrical Characteristics
(T_A = 25 °C unless otherwise noted)
Per TVS Diode Specification
Capacitance @ 0 V 1 MHz
Rated Standoff Voltage
Breakdown Voltage @ 1 mA
Clamping Voltage
@ I_P = 5 A t_P = 8/20 µs
@ I_PP = 24 A t_P = 8/20 µs
Leakage Current @ 5 V
ESD Protection: IEC 61000-4-2
Contact Discharge
Air Discharge
Surge Protection: IEC 61000-4-5
8/20 µs - Level 2 (Line - Gnd)
8/20 µs - Level 3 (Line - Line)
Thermal Characteristics
(T_A = 25 °C unless otherwise noted)
Operating Temperature Range
Storage Temperature Range
Peak Pulse Power (t_P = 8/20 µs)
Symbol
C
V_WM
V_BR
V_C
V_C
I_R
Minimum
120
6.0
±8
±15
24
24
Nominal
150
5.0
Maximum
180
9.5
11
1
10
T_J
-40
T_STG
-55
P_PP
25
+85
25
+150
250
Unit
pF
V
V
V
V
µA
kV
kV
A
A
°C
°C
W
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.