2035-35-SM Datasheet, PDF (1/2 Pages) Bourns Electronic Solutions – 2035-xx-SM Precision Gas Discharge Tube Surge Protector

*RoHS ^{VCEOARMVSAPIOILLINAASBNLTE}
Features
■ Leadless, surface mount for economical
assembly
■ Compact mini-size
■ High surge current rating
■ Low capacitance and insertion loss
■ Stable breakdown throughout life
■
UL Recognized
■ RoHS compliant* version available
2035-xx-SM Precision Gas Discharge Tube Surge Protector
Bourns now offers a surface mount (SM) 2-electrode GDT surge protection device. The industry-leading quality and features of the
Bourns^® miniature 2035 Series GDT continue in this new SM version. Compatible with “pick and place” assembly systems, the SM is
ideal for high-density applications such as PCBs for telecommunications, commercial and industrial applications.
Characteristics
Test Methods per ITU-T (CCITT) K.12, IEEE C62.31
Characteristic
DC Sparkover ±15 %
(±20 % for Model 2035-09) @ 100 V/s
Impulse Sparkover
100 V/µs
1000 V/µs
2035-09
90 V
350 V
525 V
2035-15
150 V
400 V
550 V
Model No.
2035-20
2035-23
200 V
230 V
425 V
575 V
450 V
600 V
2035-25
250 V
475 V
625 V
2035-30
300V
525 V
650 V
Characteristic
DC Sparkover ±15 % @ 100 V/s
(-12 %, +15 % for Model 2035-60) @ 100 V/s
Impulse Sparkover
100 V/µs
1000 V/µs
2035-35
350 V
600 V
750 V
2035-40
400 V
Model No.
2035-42
420 V
2035-47
470 V
650 V
800 V
675 V
850 V
750 V
950 V
2035-60
600 V
950 V
1100 V
Insulation Resistance (IR) ...................100 V (50 V for Model 2035-09) ............................................. > 10¹⁰ Ω
Glow Voltage ......................................10 mA ..................................................................................... ~ 70 V
Arc Voltage .........................................>1 A ........................................................................................ ~ 10 V
Glow-Arc Transition Current ............................................................................................................... < 0.5 A
Capacitance .......................................1 MHz ..................................................................................... < 1 pF
DC Holdover Voltage¹ .......................>135 V, (52 V for Model 2035-09,........................................... < 150 ms
80 V for Model 2035-15)
Impulse Discharge Current.................10000 A, 8/20 µs² .................................................................. 1 operation minimum
5000 A, 8/20 µs ...................................................................... > 10 operations
1000 A, 10/350 µs .................................................................. 1 operation
100 A, 10/1000 µs ................................................................. > 300 operations
100 A, 10/700 µs ................................................................... > 500 operations
Alternating Discharge Current ............20 Arms, 11 cycles² ............................................................... 1 operation minimum
5 Arms, 1 s ............................................................................. > 10 operations
Operating Temperature....................................................................................................................... -55 to +85 °C
Climatic Category (IEC 60068-1)........................................................................................................ 40/90/21
Notes:
• UL Recognized component, UL File E153537
• Surface Mount (SM) parts may show a temporary increase in DCBD after the solder reflow process. Most devices will recover
within 24 hours time. It should be noted that there is no quality defect nor change in protection levels during the temporary change
in DCBD.
• Sparkover limits after life ±20 % (-25 %, +30 % for Model 2035-09, 2035-60), IR >10⁸.
• At delivery AQL 0.65 Level II, DIN ISO 2859.
1 _{Network applied.}
2 _{Tube may exceed ±20 % but will continue to protect without venting.}
*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.