LC25WZ Datasheet, PDF (1/5 Pages) Bookham, Inc. – 2.5Gb/s Buried Het Laser non-WDM applications

Data Sheet
2.5Gb/s Buried Het Laser non-WDM applications
LC25WZ
This laser module employs the Bookham strained layer
MQW Buried Heterostructure DFB laser chip, and has been
designed specifically for use in 2.5Gb/s long distance single
channel optical fiber systems. The device is packaged in a
hermetically sealed 14-pin butterfly package incorporating an
isolator and monitor photodiode for control of the power of
the laser over life and all operating conditions.
Features:
• 2.5Gb/s operation
• Narrow spectral line-width
• Internal TEC with precision NTC thermistor for
temperature control
• Code reduction with single product for reaches up
to 175km
• GaInAsP SLMQW DFB single frequency laser chip
• InGaAs monitor Photodiode
• Hermetically sealed 14-pin butterfly package with
optical isolator
• RoHS compliant
Applications:
• TDM
• On-off ramps
• Long-Haul
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