HSMP-3810 Datasheet, PDF (7/9 Pages) Broadcom Corporation. – Surface Mount RF PIN Low Distortion Attenuator Diodes

Package Dimensions
Outline 23 (SOT-23)
e2
e1
E
XXX
e
B
D
A1
Notes:
XXX-package marking
Drawings are not to scale
E1
L
C
DIMENSIONS (mm)
SYMBOL MIN.
MAX.
A
0.79
1.20
A1
0.000
0.100
A
B
0.30
0.54
C
0.08
0.20
D
2.73
3.13
E1
1.15
1.50
e
0.89
1.02
e1
1.78
2.04
e2
0.45
0.60
E
2.10
2.70
L
0.45
0.69
Outline SOT-323 (SC-70)
e1
E
XXX
e
B
D
A1
Notes:
XXX-package marking
Drawings are not to scale
E1
L
C
DIMENSIONS (mm)
SYMBOL MIN.
MAX.
A
0.80
1.00
A
A1
0.00
0.10
B
0.15
0.40
C
0.08
0.25
D
1.80
2.25
E1
1.10
1.40
e
0.65 typical
e1
1.30 typical
E
1.80
2.40
L
0.26
0.46
Package Characteristics
Lead Material .................................................... Copper (SOT-323); Alloy 42 (SOT-23)
Lead Finish ......................................................................... Tin 100% (Lead-free option)
Maximum Soldering Temperature ............................................ 260°C for 5 seconds
Minimum Lead Strength........................................................................... 2 pounds pull
Typical Package Inductance ...................................................................................... 2 nH
Typical Package Capacitance ..............................................0.08 pF (opposite leads)
Ordering Information
Specify part number followed by option. For example:
HSMP - 381x - XXX
Bulk or Tape and Reel Option
Part Number; x = Lead Code
Surface Mount PIN
Option Descriptions
-BLKG = Bulk, 100 pcs. per antistatic bag
-TR1G = Tape and Reel, 3000 devices per 7" reel
-TR2G = Tape and Reel, 10,000 devices per 13" reel
Tape and Reeling conforms to Electronic Industries RS-481, “Taping of Surface
Mounted Components for Automated Placement.”
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