DEMO-ACMD-7403 Datasheet, PDF (3/11 Pages) Broadcom Corporation. – Miniature UMTS Band II / PCS Duplexer

ACMD-7403
Absolute Maximum Ratings ^[1]
Parameter
Storage temperature
Maximum RF Input Power to Tx Port
Unit Value
°C –65 to +125
dBm +33
Maximum Recommended Operating Conditions ^[2]
Parameter
Unit Value
Operating temperature, T_c ^[3] ,
Tx Power ≤ 29 dBm
°C –40 to +100
Operating temperature, T_c ^[3] ,
Tx Power ≤ 30 dBm
°C –40 to +85
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage to the device.
2. The device will function over the recommended range without
degradation in reliability or permanent change in performance, but
is not guaranteed to meet electrical specifications.
3. T_C is defined as case temperature, the temperature of the underside
of the duplexer where it makes contact with the circuit board.
Characterization
A test circuit similar to the one shown in Figure 1 was
used to measure typical device performance. This circuit
is designed to interface with Air Coplanar (ACP), Ground-
Signal-Ground (GSG) RF probes of the type commonly
used to test semiconductor wafers.The PCB test circuit
uses multiple vias to create a well-grounded pad to
which the device under test (DUT) is solder-attached.
Short lengths of 50-ohm microstripline connect the DUT
to ACP probe patterns on the board.
A test circuit with ACMD-7403 mounted in place is shown
in Figure 2. S-parameters are then measured using a
network analyzer and calibrated ACP probe set.
Phase data for s-parameters measured with ACP probe
circuits are adjusted to place the reference plane at the
edge of the duplexer.
Figure 1. ACP Probe Test Circuit.
Figure 2. Test Circuit with Duplexer.