DEMO-ACMD-7402 Datasheet, PDF (3/10 Pages) Broadcom Corporation. – Miniature PCS Band Duplexer

Absolute Maximum Ratings^[1]
Parameter
Unit
Storage Temperature
°C
Maximum RF Input Power dBm
to Tx Ports
Value
–65 to +125
+33
Maximum Recommended Operating Conditions^[2]
Parameter
Unit
Operating Temperature, Tc^[3], °C
Tx Power 29 dBm
Operating temperature, Tc^[3], °C
Tx Power 30 dBm
Value
–40 to +100
–40 to +85
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage to the device.
2. The device will function over the recommended range without
degradation in reliability or permanent change in performance,
but is not guaranteed to meet electrical specifications.
3. TC is defined as case temperature, the temperature of the
underside of the Duplexer where it makes contact with the circuit
board.
Characterization
A test circuit similar to that shown in Figure 1 was used
to measure typical device performance. This circuit is
designed to interface with Air Coplanar (ACP), Ground-
Signal-Ground (GSG) RF probes of the type commonly
used to test semiconductor wafers.
The test circuit is a 7 x 7 mm PCB with a well-grounded
pad to which the device under test (DUT) is solder-
mounted.
A test circuit with a ACMD-7402 mounted in place is
shown in Figure 2. S-parameters are then measured
using a network analyzer and calibrated ACP probe set
Phase data for s-parameters measured with ACP probe
circuits are adjusted to place the reference plane at the
edge of the Duplexer.
Short lengths of 50-ohm microstripline connect the DUT
to the ACP probe patterns on the board.
Figure 1. ACP probe test circuit
3
Figure 2. Test circuit with ACMD-7402 duplexer