6N140A Datasheet, PDF (3/14 Pages) AVAGO TECHNOLOGIES LIMITED – Hermetically Sealed, Low IF, Wide VCC, High Gain Optocouplers

6N140A, HCPL-675x, 83024, HCPL-570x, HCPL-177K, 5962-89810, HCPL-573x, HCPL-673x,
5962-89785, 5962-98002
Data Sheet
Functional Diagrams
Package
16-pin DIP
8-pin DIP
8-pin DIP
16-pin Flat Pack 20-Pad LCCC
Butt Cut/Gold Plate^a
Butt Cut/Soldered^b
Gull Wing/Soldered^b
Crew Cut/Gold Plate^a
Crew Cut/Soldered^b
Class K SMD Part Number
Prescript for all below
Gold Plate^a
Solder Dipped^b
Butt Cut/Gold Plate^a
Butt Cut/Soldered^b
Gull Wing/Soldered^b
Crew Cut/Gold Plate^a
Crew Cut/Soldered^b
8302401YC
8302401YA
8302401XA
8302401ZC
8302401ZA
5962-
9800201KEC
9800201KEA
9800201KYC
9800201KYA
9800201KXA
9800201KZC
9800201KZA
8981001YC
8981001YA
8981001XA
5962-
8981002KPC
8981002KPA
8981002KYC
8981002KYA
8981002KXA
8978501YC
8978501YA
8978501ZA
5962-
8978503KPC
8978503KPA
8978503KYC
8978503KYA
8978503KZA
5962-
9800201KFC
5962-
8978504K2A
a. Gold Plate lead finish: Maximum gold thickness of leads is <100 micro inches. Typical is 60 to 90 micro inches.
b. Solder lead finish: Sn63/Pb37.
Functional Diagrams
16-pin DIP
Through Hole
4 Channels
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
8-pin DIP
Through Hole
1 Channel
1
8
2
7
3
6
4
5
8-pin DIP
Through Hole
2 Channels
1
8
2
7
3
6
4
5
16-pin Flat Pack
Unformed Leads
4 Channels
1
16
2
1155
3
1144
4
13
5
12
6
11
7
10
8
9
20-Pad LCCC
Surface Mount
2 Channels
15
VCC2
19
VO2 ₁₃
20
GND2
12
2
VCC1 10
3
GND1
VO1
78
NOTE All DIP and flat pack devices have common V_CC and ground. LCCC (leadless ceramic chip carrier) package has
isolated channels with separate V_CC and ground connections. All diagrams are top view.
Broadcom
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