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HMPP-3860 Datasheet, PDF (2/10 Pages) Broadcom Corporation. – MiniPak Surface Mount RF PIN Diodes
HMPP-386x Series Absolute Maximum Ratings [1], Tc = 25°C
Symbol Parameter
Units
If
Forward Current (1 µs pulse)
Amp
PIV
Peak Inverse Voltage
V
Tj
Junction Temperature
°C
Tstg
Storage Temperature
°C
θ
jc
Thermal Resistance[2]
°C/W
MiniPak 1412 /
MiniPak QFN
1
100
150
-65 to +150
150
Notes:
1. Operation in excess of any one of these
conditions may result in permanent dam-
age to the device.
2. TC = +25°C, where TC is defined to be the
temperature at the package pins where
contact is made to the circuit board.
ESD WARNING:
Handling Precautions Should Be Taken
To Avoid Static Discharge.
MiniPak1412
Electrical Specifications, Tc = +25°C, each diode
Part Number
HMPP-
Package
Marking Code Lead Code
Configuration
3860
H
0
Single
3862
F
2
Anti-parallel
3865
E
5
Parallel
  Test Conditions
Minimum Breakdown
Voltage (V)
50
Typical Series
Resistance (Ω)
3.0/1.5*
VR = VBR
Measure
IR ≤ 10 µA
IF = 10 mA
f = 100 MHz
*IF = 100 mA
MiniPak1412
Typical Parameters, Tc = +25°C
Part Number
HMPP-
Total Resistance
RT (Ω)
3860
22
3862
3865
Carrier Lifetime
τ (ns)
500
  Test Conditions
IF = 1 mA
IF = 50 mA
f = 100 MHz
TR = 250 mA
Reverse Recovery Time
Trr (ns)
80
VR = 10 V
IF = 20 mA
90% Recovery
Total Capacitance
CT (pF)
0.20
VR = 50V
f = 1 MHz