BCS8 Datasheet, PDF (2/3 Pages) Bi technologies – 8W CURRENT DETECT CHIP RESISTORS

BCS 8
8W 5025 CURRENT DETECT RESISTOR
Frequency Characteristics
Impedance(Ω)
　　　
0.050
　　　　　　　　　　
0.010
0.005
0.001
10k
100k
1M
10M
Frequency(Hz)
Temperature Rise
Temperature (°C) at hot spot.
250
200
BCS 8 R001 F
150
100
50
0
0
2
4
6
8 10 12
Applied Power (W)
∆R/R (ppm)
+4000
+2000
0
-2000
Dotted line: typical measurement
TCR Curves
Slope of +30ppm/°C
Slope of –30ppm/°C
-4000 //
-50
0
25
50
75
100
125
Resistor Temperature (°C)
Recommended Foot Print (mm)
7.4
2.5
2.5
9.0
Soldering Recommendation
Due to the enhanced heat dissipation properties of the BCS8, the temperature profile during reflow
soldering will need to be increased by: 10 to 20°C.
Custom designs
Alternative widths and lengths are available, please contact factory for details.
FR4 Thermal PCB Characterisation
Pad Dimensions (x,y mm)
60, 45
50, 45
40, 40
30, 30
20, 20
10, 10
P_{90 °C, 70um} (W)
5.8
5.4
4.2
3.5
2.9
2.4
P_{90 °C, 35um} (W)
4.6
4.3
Y
4.1
M
2.8
M
2.7
2.5
X MM
BCS 8
Notes: Characterisation carried out using 70µm and 35µm PCB copper pad weights, with the temperature of 90°C used as a
maximum reference on the PCB.
2