HA72E-12 Datasheet, PDF (1/2 Pages) Bi technologies – High Power High Performance Molded Surface Mount Inductors

Magnetics
High Power High Performance
Make Possible
Molded Surface Mount Inductors
Model HA72E-12


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Fe_a_t_u_r_e_ï€s_a_n_d_B_e_n_e_f_it_s_{}
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
Operating Temperature -40°C to +155°C
High Power High Performance Molded
Temperature Rise, Maximum 40°C
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Ope_ rating Frequency Up to 5MHz
Surface Mount Inductors
 

 

AEC^ -Q200 Certified
RoH_ S Compliant
 
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
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

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Inductance⁽¹⁾
Part Number
Specification @ 25°C ^µH±20%


Heating
Current⁽²⁾
(Adc)

Isat⁽³⁾
(Adc)

DCR (mΩ)
Typ.

Max.


^Pa^rt^N^u^m^b^er

^HA⁷^2E^-1²ï€£^R6⁸^H^LF
^HA⁷^2E^-¹²ï€£^1R⁰^H^LF
^HA⁷^2E^-¹²ï€£^1R⁵^H^LF

In_d_μu_Hc_±t₂a_0n_%ce⁽¹⁾

^0.⁶⁸
¹ï€¬^.⁰⁰
¹ï€¬^.⁵⁰
Heatin^g^
Curren_t⁽²_⁾ _
(Adc)_{}
35 _{}
32 _{}
27 _

(IAsadtc³)^{)}

35 _{}
31 _
27 _


^{DCR (mΩ}⁾ 
Ty_p._{}
^M^a^x.
1._4_{}
^1.⁶
1_.7_{}
²ï€§^.0
2_.5_{}
³ï€˜^.0
HA72E-122R2HLF
2.20
22
24
3.5
4.2
_{HA72E-123R3HLF}

^{HA72E-124R7HLF}
3.30
18
4.70
13
20
5.7
6.8
15
9.3
11.2
 _{HA72E-126R8HLF}
6.80
11
11
13.1
14.0
_H_A₇₂_E_-1₂₁₀₀_H_{LF}  _10_.0 ₁₀_{9 16.4 17.2}
HA7_2_E_-_1_2_2_0_0_H_L_F_{}2_0_._0_{  }5_{ }8_{}3_7_.0_{}4_0.5

Notes:
                
(1)
(2)
I_Tn_hd_eu_Hct_ea_an_tc_ine_gis_Cm_ure_reas_nu_tr_ie_sd_tha_et_{a}1_p0_p0_{r}k_oH_xiz_m, 0_a._t1_eV_Da_{C}c_w_cui_t_rh_reo_nu_tt_{w}D_hC_{ic}c_hu_r_cr_ae_un_st_e. _{sthe componenttemperature}
to
increase
by
40°C.
This
current
is
determined
by
soldering
the
component
on
a
typical
application
PCB, and^t^he^n^ a^pp^ly^in^g^t^he^c^u^r^r^en^t t^o t^h^e^d^e^vic^e^f^o^r ^30^m^in^u^te^s.^{}
(3) The saturation current (Isat) is the approximate current at which the inductance will be decreased by 20% typical from its initial (zero DC) value.
(4) The pa_rt temperature (ambient + temperature rise) should not exceed 155°C.
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Outline Dimensions (mm)
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