BB1110RC Datasheet, PDF (1/2 Pages) Bi technologies – Resistor capacitor network Thick film resistors Ceramic chip capacitors

MODEL BB1110RC
Resistor capacitor network
Thick film resistors
Ceramic chip capacitors
DISCRIPTION
Model BB1110RC is designed for terminating high-speed memory buses. Ideally suited for local
decoupling of data line drivers. These specialty networks employ solder balls for surface mount flip
chip attachment. Their unique construction yields extremely low capacitance and inductance
parasitics critical for these high-speed applications.
FEATURES
• Integrated resistor and capacitor network
• High density packaging
• High temperature solder balls
• Industry standard ball diameter and pitch
• Excellent high frequency performance
SCHEMATIC
C1-9 = 0.1uF
R1-9 = 50 Ω
ELECTRICAL¹
Resistance Tolerance
Capacitance Tolerance
Capacitor Type
Capacitor Maximum Voltage
TCR
Operating Temperature Range
Maximum Resistor Power
Package Power Rating
± 1%
± 10%
X5R
10 volts
200 ppm/°C
-55°C to +85°C
0.05 watts at 70°C
1.0 watt @ 70°C
1 _{Specifications subject to change without notice.}
BI Technologies Corporation
4200 Bonita Place, Fullerton, CA 92835 USA
Phone: [phone] Website: www.bitechnologies.com
August 30, 2005
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BI technologies