170 Datasheet, PDF (1/2 Pages) Bi technologies – Custom Power Modules

MODEL 170
Custom Power Modules
CUSTOM POWER MODULES
DESCRIPTION
BI’s Custom Power Modules are designed to assemble all
of your circuit’s power components into one, easy to
manage, package. Power modules offer a low cost
method to improve the circuit density. These modules will
also reduce the assembly labor by eliminating insulating
pads and reducing the individual bolting of discreet power
semiconductors. BI offers power module designs that
allow the module to be soldered to the circuit board at the
same time as the other components, eliminating hand
soldering operations. Power modules allow the use of a
simpler and less expensive heat sink.
All the power components normally bolted to the heat sink
should be included in the custom module.
FEATURES AND BENEFITS
TYPICAL APPLICATIONS
• Low cost custom modules
• Reduced circuit size
• Allows simplified heat sink
• Soldering technique minimizes voids
• Flexible package dimensions
PACKAGING
• Power supply subassemblies
• Motor driver
• Power amplifier
• H-Bridge
• Bridge rectifier
• Ganged power FETs
Package Size
Custom packaging from 0.3” to 4.0” on a side.
Package, Typical
Package Configurations
Heat sink attachment and heat transfer.
Ceramic substrate, typically copper clad to promote heat transfer.
7
Base with mounted components is assembled into a custom frame and encapsulated.
Specifications subject to change without notice.
7-13
Model 170