BZG04 Datasheet, PDF (1/4 Pages) NXP Semiconductors – Transient voltage suppressor diodes

Production specification
TRANSIENT VOLTAGE SUPPRESSOR
BZG04--SERIES
FEATURES
 Plastic package has underwriters laboratory
flammability classification 94V-0
 Optimized for LAN protection applications
 Low profile package with built-in strain relief for
surface mounted applications
 Glass passivated junction
 Low incremental surge resistance, excellent clamping capability
 300W peak pulse power capability with a 10/1000μs wave form,
repetition rate (duty cycle): 0.01%
 Very fast response time
 High temperature soldering guaranteed: 250°C/10 seconds at terminals
MECHANICAL DATA
 Case: JEDEC DO-214AC molded plastic over passivated chip
 Terminals: solder plated, solderable per MIL-STD-750, method 2026
 Mounting position: any Weight: 0.002 ounces, 0.064 grams
Devices for Bidirectional Applications
For bi-directional devices, use suffix C (e.g. BZG04-10C). Electrical characteristics apply in both directions.
Maximum Ratings and Thermal Characteristics
Ratings at 25℃ ambient temperature unless otherwise specified
SYMBOL
VALUE
UNITS
Non-repetitive peak reverse power dissipation 10/1000s
exponential pulse(see Fig.3); TJ=25℃prior tosurge; see also
Fig.1
Typical thermal resistance, junction to ambient
Forward voltage @IF=0.5A; seeFig.2
PRSM
RθJA
VF
300
100(NOTE1)
150(NOTE2)
1.2
W
℃/W
V
Operating junction temperature range
RθJL
-55---+175
℃
Operating storage temperature range
TJ
-55---+175
℃
NOTES: (1) Device mounted on an Al2O3 printed-circuit board, 0.7mm thick; thickness of Cu-layer ≥35m, see Fig.4.
(2) Device mounted on an epoxy-glass printed-circuit board, 1.5mm thick; thickness of Cu-layer ≥40μm, see Fig.4.
For more information please refer to the "General Part of associated Handbook".
Document Number:SMA602AA
www.gmicroelec.com
1