BD23B_14 Datasheet, PDF (1/5 Pages) BeRex Corporation – Dual Band 2-Way SMT Power Divider

BD23B
Dual Band 2-Way SMT Power Divider
1900~2500MHz PCS, WCDMA & TD-SCDMA, WiBro
Device Features
 Typical Isolation = 25 dB
 Typical Insertion Loss = 0.4 dB
 MSL 3 moisture rating
 Lead-free/RoHS-compliant SOIC-8 Plastic Package
With exposed back side ground pad
Product Description
BeRex’s Divider BD23B is designed for PCS,
WCDMA & TD-SCDMA and WiBro band with
low Insertion Loss and Isolation. This chip is
fully passivated for enhanced performance
and reliability and packaged in RoHS-
compliant with SOIC-8 surface mount pack-
age. It can be used without back side ground
soldering. (This may degrade the perfor-
mance at the high frequency edge.)
Typical Performance¹
Parameter
Min Typical Max Unit
Frequency Range
1900
2500 MHz
Insertion Loss
0.4
0.8
dB
Isolation
15
25
dB
IRL(S11)
-23
-15 dBm
ORL(S22/S33)
-25
-15 dBm
Amplitude Balance
Phase Balance
0.05
0.2
dB
0.5
1.0
deg
*All specifications apply to the following test conditions,
1. Device performance _ measured on BeRex E/B at 25°C, 50ohm system.
2. Insertion Loss: Above 3.0dB.
3. Back side ground _ soldered.
Applications
 Base station Infrastructure
 Commercial/Industrial/Military wireless system
Absolute Maximum Ratings
Parameter
Rating
Input Power
1W CW dBm
Storage Temperature
-55 to +155°C
Operating Temperature
-40 to +85°C
Operation of this device above any of these parameters may result in permanent damage.
Evaluation Board Drawing
Function Block Diagram
Pins 1,3,4,6 and 7 must be DC and RF grounded.
BeRex
●website: www.berex.com
●email: [e-mail]
Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex.
All other trademarks are the property of their respective owners. © 2010 BeRex
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Rev. D