BD23B Datasheet, PDF (1/5 Pages) BeRex Corporation – Triple Band 2-Way SMT Power Divider 1900~2500MHz PCS, WCDMA & TD-SCDMA, WiBro

BeRex
Triple Band 2-Way SMT Power Divider
1900~2500MHz PCS, WCDMA & TD-SCDMA, WiBro
BD23B
Device Features and Description
 25dB Typical Isolation
 0.4dB Typical Insertion Loss
 Small Size and Low Profile
 MSL 1 moisture rating
 Lead-free/Green/RoHS compliant package
Application: commercial, space, military wireless system
 Industry Standard SOIC-8 SMT Plastic Package with exposed back side ground pad
 Chip is fully passivated for enhanced performance and reliability
 Can be used without back side ground soldering
(This may degrade the performance at the high frequency edge. Refer to the following
typical test data)
Electrical specifications
Parameters
Unit
Min
Typ
Frequency Range
MHz
1900
Insertion Loss
dB
0.4
Isolation
dB
15
25
IRL(S11)
dB
-23
ORL(S22,S33)
dB
-25
Amplitude Balance
dB
0.05
Phase Balance
deg
1.0
All specifications apply with the following test conditions,
1. Device performance is measured on BeRex evaluation board at 25C, 50 ohm system
2. Insertion Loss: Above 3.0dB
3. Back side ground was soldered
Max
2500
0.8
-15
-15
0.2
2.0
Absolute Maximum Ratings
Parameters
Rating
Input Power
1W CW
Storage Temperature
-55 to +155C
Operating Temperature
-40C to +85C
Operation of this device above any of these parameters may result in permanent damage.
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