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BD2326_14 Datasheet, PDF (1/4 Pages) BeRex Corporation – Triple Band 2-Way SMT Power Divider
BD2326
Triple Band 2-Way SMT Power Divider
1900~2500MHz PCS, WCDMA & TD-SCDMA, WiBro
Device Features
 Typical Isolation = 20.0 dB
 Typical Insertion Loss = 0.6 dB
 MSL 3 moisture rating
 Small Size and Low Profile
 Lead-free/RoHS-compliant SOT-26 Plastic Package
BD23XX(XX=Wafer number)
Product Description
BeRex’s Divider BD2326 is designed for PCS,
WCDMA & TD-SCDMA and WiBro band with
low Insertion Loss and Isolation. This chip is
fully passivated for enhanced performance
and reliability and packaged in RoHS-
compliant with SOT-26 surface mount pack-
age.
Typical Performance1
Parameter
Min Typical Max Unit
Frequency Range
1900
2500 MHz
Insertion Loss
0.65
0.9
dB
Isolation
15
20
dB
IRL(S11)
-15
-10 dBm
ORL(S22/S33)
-22
-18 dBm
Amplitude Balance
Phase Balance
0.06
0.2
dB
0.8
1.0
deg
*All specifications apply to the following test conditions,
1. Device performance _ measured on BeRex E/B at 25°C, 50ohm system.
2. Insertion Loss: Above 3.0dB.
Applications
 Base station Infrastructure
 Commercial/Industrial/Military wireless system
Absolute Maximum Ratings
Parameter
Input Power
Storage Temperature
Operating Temperature
Rating
1W CW dBm
-55 to +155°C
-40 to +85°C
Operation of this device above any of these parameters may result in permanent damage.
Evaluation Board Drawing
Function Block Diagram
Pins 2,4 and 6 must be DC and RF grounded.
BeRex
●website: www.berex.com
●email: sales@berex.com
Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex.
All other trademarks are the property of their respective owners. © 2010 BeRex
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Rev. D